Wafer-level Chip Scale Packages (WLCSPs) are key enablers of smaller, thinner, higher functionality devices that are driving advances in mobility, integration and expansive connectivity (IoT). The mobile phone market has been the primary catalyst for the growth in WLSCP packages in recent years, highly benefiting from the thinner, higher-density ball count capabilities of modern-day WLCPS. The trend toward prolific connectivity through new wearable devices, among other technologies, help maintain the growth rate of WLCSPs.
With the decreasing dimensions and finer ball pitches come increasing wafer processing and handling challenges. Die chipping and cracking, wafer warpage and damage during the SMT placement process onto the PCB substrate are all potential obstacles that have to be overcome for high-yield WLCSP production. Recent advances in film technology have resulted in a new class of materials that help alleviate some of the traditional obstacles with handling and reliability of WLCSPs. Novel backside protection (BSP) films offer packaging subcontractors a technique that helps reduce mechanical damage, while improving laser marking performance and reliability. Additionally, the latest development of liquid compression molding compounds with minimum warpage can be used to map mold and package the chip on the wafer level; opening new pathways to completely reform and reintroduce the way IC packaging is being done.