Wafer backside coating materials allow for screen or stencil printing of the paste across the entire wafer in a single stroke, increasing throughput by eliminating the need to individually dispense dots of adhesive.
Wafer backside coating provides consistent bond lines and small, controlled fillets which are particularly effective for attaching small die in miniaturized packages and challenging structures like chip on lead where the die pad is smaller than the die. It enables process speed, thickness control and material uniformity and it is critical for die attach applications where fillet control is critical.