Technical Requirements for 3D Memory TSV

Key requirements for NCF

• Soft film to laminate bumped wafer
• Transparency for bump recognition
• Fast cure to hold die in place after
• Thermal Compression Bonding process (<5s)
• High Tg & Low CTE for thermal cycling reliability

Technical approach

• Free radical chemistry for rapid transformation of physical properties (soft to rigid)
• Nano size silica filler with high concentration (>40wt%)

NCF (Pre-Applied)

• NCF85C (gen1),
• NCF220 (gen2)