Memory
Technical Requirements for 3D Memory TSV
Key requirements for NCF
- Soft film to laminate bumped wafer
- Transparency for bump recognition
- Fast cure to hold die in place after
- Thermal Compression Bonding process (<5s)
- High Tg & Low CTE for thermal cycling reliability
Technical approach
- Free radical chemistry for rapid transformation of physical properties (soft to rigid)
- Nano size silica filler with high concentration (>40wt%)
NCF (Pre-Applied)
- NCF85C (gen1),
- NCF220 (gen2)