Advanced Packaging

Advanced Packaging

Flip Chip, Wafer level and 3D memories

CSP, BGA, PoP, Fan in, Fan out


Technical Requirements for 3D Memory TSV

Key requirements for NCF

  • Soft film to laminate bumped wafer
  • Transparency for bump recognition
  • Fast cure to hold die in place after
  • Thermal Compression Bonding process (<5s)
  • High Tg & Low CTE for thermal cycling reliability


Technical approach

  • Free radical chemistry for rapid transformation of physical properties (soft to rigid)
  • Nano size silica filler with high concentration (>40wt%)


NCF (Pre-Applied)

  • NCF85C (gen1),
  • NCF220 (gen2)