Encapsulants and Underfills

Encapsulants and Underfills for Semiconductor packaging & Optical grade LED encapsulation

Epoxies, silicones or hybrid technologies

Encapsulants & Underfills

High purity liquid epoxy self-leveling encapsulants are designed to work together as dam and fill materials for bare chip encapsulation, protecting gold wire bonds and silicon die from mechanical damage and corrosion. Although these materials are typically used together in dam and fill applications, the low viscosity "fill" materials can be used alone in devices that contain a cavity. Encapsulants can meet stringent JEDEC level testing requirements and are compatible with the high temperature processing demanded for lead-free assembly.
Chip on Board Liquid Encapsulants cure to form void-free globs when exposed to heat, with formulations for low CTE, minimizing stress on wire bonds during thermal cycling. These encapsulants are easy-to-dispense, minimize induced stresses, provide improved temperature cycling performance, and offer excellent chemical resistance.

Underfills offer easy reworkability as well as excellent vibration and impact resistance. These underfills offer many processing advantages such as fast flow, fast cure, and long pot life. Our new Cornerbond technology fits easily into an SMT process flow and eliminates a separate underfill dispense and cure process, saving time and money.
Flip chip underfills are used in devices such as FC CSPs and FC BGAs for ASICs, chipsets, graphics chips, digital processors, and microprocessors. These fast flow materials permeate easily under large die. Offering excellent adhesion when used with a variety of no-clean fluxes, these underfills will not crack after thermal shock or thermal cycling.

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Encapsulants and Underfills are affected by REACH regulations


REACH is the acronym for Registration, Evaluation, Authorization and Restriction of Chemicals.

  • European union regulation that started in 2007 and their goal is to improve the protection of human health and the environment from the risks that can be posed by chemicals. 
  • Encapsulants fall under the REACH regulations. That’s why manufacturers, importers and end users need to ensure that their products and the products that they are using are REACH compliant.

REACH places the burden of proof on companies.

  • Companies must identify and manage the risks linked to the substances they manufacture and market in the European Union
  • Companies must demonstrate to European Chemical Agency (ECHA) how the substance can be safely used, and they must communicate the risk management measures to the users
  • If the risks cannot be managed, authorities can restrict the use of substances in different ways
  • In the long run, the most hazardous substances should be substituted with less dangerous ones

REACH Services provided by CAPLINQ

  • REACH Only Representative provides a legal entity in the European Union (EU) for the "chemical import       responsibility" of substances into Europe.
  • ORO, Brexit, Consulting, Registering and Testing


What does SVHC mean?

Substances fulfilling one or more of the criteria defined in Article 57 of the EU REACH regulation can be identified as “Substances of Very High Concern" (SVHC) and put on the “Candidate List for Authorization" which is also called "REACH SVHC list“

  • Substances meeting the criteria for classification as Carcinogenic, Mutagenic or Reprotoxic (CMR) cat 1 or 2,
  • Persistent, bio-accumulative and toxic (PBT) substances,
  • Very persistent and very bio-accumulative (vPvB) substances,
  • Substances for which there is evidence for similar concern, such as endocrine disruptors

Common Substances of Very High Concern.

  • Many Semiconductor Grade encapsulants contain an Anhydride based resin system. 
  • Some of these Anhydrides are SVHC listed, so they may be banned for use in Europe in future
  • All materials supplied by Henkel comply with REACH and SVHC regulations


How does SVHC affect you?


SVHC Free Encapsulants

Dam and Fill

  FP 4451TD DAM 7010C FP 4450HF FP 4470 FP 4651 FP 4802 FIL 7010C 
Type Dam Fill
Silica filler (%) 73 80 73 75 82 72 80
Viscosity (cP) 300,000 92,500 32,000 42,000 100,000 80,000 25,000
CTE ?1 (ppm/°C) 21 16 21 18 11 20 16
Tg (°C) 150 140 164 148 150 50 140
Cure Time (min) 30 + 90 60 + 60 30 + 90 30 + 90 150 + 150 30 + 90 60 + 60
Cure Temperature 125 + 165 100 + 150 125 + 165 125 + 165 110 + 150 125 + 165 100 + 150


Glob Top

  EO 1016  EO 1072 EO 7021 FP 4460 FP 50300HT FP 50400-1 FP4323 EN 3838T 8387BM
Type Refrigerated Frozen
Viscosity (cP) 62,000 80,000 17,000 300,000 130,000 40,000 100,000 6,700 14,000
CTE ?1 (ppm/°C) 46 43 67 20 20 20 28 57 88
Tg (°C) 126 135 125 173 140 140 174 2 122
TC (W/mK) ~0.4 ~0.5 ~0.5 - 0.63 0.63 0.63 0.22 -
Cure Time (min) 20 5 60 180 120 120 240 8 60
Cure Temp(°C) 150 140 - 150 120 150 150 150 150 130 100


SVHC Free Underfills


LOCTITE® ECCOBOND UF 1173 material has been formulated without any reportable REACH SVHCs (current to June 2018) and the product is not CMR classified.