Board level Underfills |
Loctite 3508NH | Reworkable cornerbond | 70,000 | 118 | 65 | 175 | - | 245 | Yes | - Pb free Solder reflow cure
- Preapplied to the pad corners
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Loctite 3517M | Reworkable underfill for solder joint protection | 2,600 | 101 | 65 | 191 | 5 | 120 | Yes | - Solder joint protection
- CSP, Flip chip, BGA packages
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Loctite ABLESTIK ACP 3122 | Anisotropic epoxy adhesive (Z axis) | 22,000 | 100 | - | - | 5 seconds | 150 | Yes | - Conductive only in z axis
- Anisotropic electrically conductive
- Low temperature cure
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Loctite ECCOBOND E1172A | Non reworkable capilary underfill | 17,000 | 135 | 27 | 85 | 6 | 135 | Yes | - Uniform and void-free
- Minimizes induced stress at the solder joint
- Use with very fine area array devices with 25 μm geometries
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Loctite ECCOBOND E1216M | Capillary flow epoxy underfill | 4,000 | 125 | 35 | 131 | 4 | 150 | Yes | - Snap, fast and low temp cure
- Non anhydride curing agents
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Loctite ECCOBOND FP4502 | Single component liquid epoxy underfill | 35,000 | 115 | 22 | 84 | 30 | 165 | Yes | - Forms a rigid, low stress seal
- Extends thermal cycling performance
- Low CTE
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Loctite ECCOBOND FP4526 | Liquid epoxy capillary underfill | 4,700 | 133 | 33 | 101 | 15 | 165 | Yes | - Suitable for applications that require high thermal cycling performance
- For capillary flow on flip chip applications with excellent reliability
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Loctite ECCOBOND FP4527 | Epoxy capillary underfill | 12,000 | 158 | 26 | 87 | 15 | 165 | Yes | - Excellent wettability
- Low viscosity
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Loctite ECCOBOND FP4530 | Snap curable fast flowing Underfill | 3,500 | 145 | 46 | 150 | 7 | 160 | Yes | - Changes from blue to green upon cure
- For flip chip on flex applications with a 25 μm gap
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Loctite ECCOBOND FP4531 | Snap curable non reworkable underfill | 10,000 | 161 | 28 | 104 | 7 | 160 | Yes | - Passes NASA outgassing
- For flip chip on flex applications with a 25 μm gap
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Loctite ECCOBOND UF1173 | One component void free underfill | 7,500 | 160 | 26 | 103 | 5 | 150 | Yes | - Can be jet or needle dispensed
- REACH/SVHCs compliant
- High Tg and low CTE
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Loctite ECCOBOND UF3810 | Reworkable epoxy underfill | 394 | 102 | 55 | 171 | 8 | 130 | Superseded by UF3811 | - Halogen free
- Higher Tg version of LOCTITE ECCOBOND UF 3800
- Cures quickly at moderate temperatures
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Loctite ECCOBOND UF3811 | Reworkable epoxy underfill | 354 | 124 | 61 | 190 | 30 | 110 | Yes | - Room temperature flow capability
- Higher Tg version of LOCTITE ECCOBOND UF 3810
- Cures quickly at moderate temperatures
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Loctite ECCOBOND UF3812 | Reworkable epoxy designed for CSP,WLSCP and BGA | 350 | 131 | 48 | 175 | 10 | 130 | Yes | - Flows at room temperature with no preheat
- High tg and high fracture toughness
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Loctite ECCOBOND UF3820 | Reworkable epoxy designed for CSP,WLSCP and BGA | 340 | 133 | 51 | 172 | 10 | 130 | Yes | - Flows at room temperature with no preheat
- Stable electrical performance under thermal BIAS
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Loctite ECCOBOND UF3915 | Reworkable underfill designed for WLSCP and flip chip | 5,500 | 125 | 25 | 100 | 7 | 160 | Yes | - Compatible with most Pb free solders
- Halogen free, Snap curable
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Loctite ECCOBOND UF8806G | Cyanate ester with superior adhesion | 4,500 | 136 | 27 | 97 | 45+60 | 195 | Yes | - 1-3mil gap heights
- Silica filled
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Semiconductor Underfills |
Loctite ECCOBOND FP5201 | BMI/Acrylate for flip chip | 21,000 | 171 | 31 | 65 | 30 | 165 | Yes | - Thermal compression bonding
- Works well with Solder,Au, Cu pads
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Loctite ECCOBOND NCP5209 | Non conductive paste Underfill | 12,500 | 145 | 28 | 80 | 30 + 120 | Ramp to 160 | Yes | - #1 Non Conductive Paste Underfill
- Paste version of NCF218
- Bump protection of flip-chip devices, with bump pitches less than 100 µm and gaps less than 40 µm
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Loctite ABLESTIK NCF218 | Non conductive underfill film | - | 119 | 24 | 190 | 30 + 60 | Ramp to 175 | Yes | - Film version of NCP 5209
- Enables fine pitch, narrow gap Cu pillar
- TSV, Die to die & Die to substrate
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Loctite ECCOBOND UF8830S | Liquid epoxy capillary underfill for BGA | 22,120 | 118 | 25 | 100 | 30 + 120 | Ramp to 150 | Yes | - Achieves MSL L3/L2A and passes all reliability requirements
- Excellent wettability to different substrates
- Formulated for tight bump pitch and narrow gap in flip chip BGA applications
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