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Underfills

Underfills for Flip chips and BGA arrays

AVAILABLE DIRECTLY AT CAPLINQ.COM

Underfills

Capillary flow underfills for CSP, BGA, WLCSP, LGA and other similar devices lower stress, improve reliability and offer outstanding processability.

Underfills offer the highest levels of reliability with the options of both reworkable and non-reworkable formulations. Materials are available that deliver ultimate processability with fast flow speeds and the capability to effectively fill bottom-side component spaces with extremely low bump heights. Formulations are designed to reduce stress caused by mismatched expansion coefficients, and have outstanding reliability in thermal cycling, thermal shock, drop testing and other demanding tests, as well as in use.

To enhance the reliability of many handheld devices, underfills offer formulations that quickly fill the space between the package and board, cure fast, offer outstanding protection for solder joints against mechanical strains such as shock, drop and vibration, and allow for reworkability. When full underfill is not required, cornerbond and edgebond technologies provide a cost-effective solution, with strong perimeter reinforcement and self-centering capability.

Semiconductor and Board level Underfills
Product	Description	Viscosity (MPa-s)	Glass transition temperature (°C)	CTE a1	CTE a2	Cure time (min)	Cure Temp °C	Available	Key attributes
Board level Underfills
Loctite ECCOBOND E1172A	Non reworkable capilary underfill	17,000	135	27	85	6	135	Yes	Uniform and void-free Minimizes induced stress at the solder joint Use with very fine area array devices with 25 μm geometries
Loctite ECCOBOND FP4502	Single component liquid epoxy underfill	35,000	115	22	84	30	165	Yes	Forms a rigid, low stress seal Extends thermal cycling performance Low CTE
Loctite ECCOBOND FP4526	Liquid epoxy capillary underfill	4,700	133	33	101	15	165	Yes	Suitable for applications that require high thermal cycling performance For capillary flow on flip chip applications with excellent reliability
Loctite ECCOBOND FP4530	Snap curable fast flowing Underfill	3,500	145	46	150	7	160	Yes	Changes from blue to green upon cure For flip chip on flex applications with a 25 μm gap
Loctite ECCOBOND FP4531	Snap curable non reworkable underfill	10,000	161	28	104	7	160	Yes	Passes NASA outgassing For flip chip on flex applications with a 25 μm gap
Loctite ECCOBOND UF1173	One component void free underfill	7,500	160	26	103	5	150	Yes	Can be jet or needle dispensed REACH/SVHCs compliant High Tg and low CTE
Loctite ECCOBOND UF3810	Reworkable epoxy underfill	394	102	55	171	8	130	Superseded by UF3811	Halogen free Higher Tg version of LOCTITE ECCOBOND UF 3800 Cures quickly at moderate temperatures
Loctite ECCOBOND UF3811	Reworkable epoxy underfill	354	124	61	190	30	110	Yes	Room temperature flow capability Higher Tg version of LOCTITE ECCOBOND UF 3810 Cures quickly at moderate temperatures
Loctite ABLESTIK ACP 3122	Anisotropic epoxy adhesive (Z axis)	22,000	100	-	-	5 seconds	150	Yes	Conductive only in z axis Anisotropic electrically conductive Low temperature cure
Semiconductor Underfills
Loctite ECCOBOND UF8830S	Liquid epoxy capillary underfill for BGA	22,120	118	25	100	30 + 120	Ramp to 150	Yes	Achieves MSL L3/L2A and passes all reliability requirements Excellent wettability to different substrates Formulated for tight bump pitch and narrow gap in flip chip BGA applications
Loctite ECCOBOND NCP5209	Non conductive paste Underfill	12,500	145	28	80	30 + 120	Ramp to 160	Yes	#1 Non Conductive Paste Underfill Paste version of NCF218 Bump protection of flip-chip devices, with bump pitches less than 100 µm and gaps less than 40 µm
Loctite ABLESTIK NCF218	Non conductive underfill film	-	119	24	190	30 + 60	Ramp to 175	Yes	Film version of NCP 5209 Enables fine pitch, narrow gap Cu pillar TSV, Die to die & Die to substrate