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LOCTITE ECCOBOND FP 5201 is designed for thermal compression bonding processes in flip chip to laminate assembly. It is a non conductive, high purity hybrid that provides excellent protection on electrical joints.
LOCTITE ECCOBOND FP 5201 is compatible with small assembly gap and tight pitches. A heat curable underfill that works well with solder, Gold and Cu pads on fine pitch laminate substrates.
Thermal Compression Bonder (TCB) Cure:
The DSC Cure Kinetics curve shows the cure speed of the FP5201 at temperatures from 120°C up to 240°C