Product Description
LOCTITE ECCOBOND FP4323 liquid epoxy encapsulant glob top is designed with flow capabilities that allows encapsulation without flowing beyond the chip. Among its other benefits, it provides excellent moisture and chemical resistance.
LOCTITE ECCOBOND FP4323 is a thixotropic, high purity encapsulant with low CTE for improved thermal cycling. It is typically used for chip on board and plastic PGA applcations.
Cure Schedule
- 4 hours @ 150°C or
- 1 hour @ 170°C or
- 2 hours @ 125°C + 4 hours @ 150°C