Solder pastes

Best-in-class thermal performance, flexibility, reflow and reliability

AVAILABLE DIRECTLY AT CAPLINQ.COM

Solder Pastes

We offer a portfolio of solder die attach pastes that deliver the process flexibility, thermal performance, high reliability and ease of use that modern power device manufacturers demand. They provide the thermal management necessary for today’s smaller outline, higher functioning semiconductor power devices, while also delivering the processability and versatility associated with solder paste materials.

Optimized rheology allows for printing or dispensing depending on process preferences and advanced flux technology is compatible with a wide range of reflow profiles to enable alloy adaptation when required. These products offer robust options for application-specific thermal requirements and overcome many of the issues historically associated with alternative products.

Compare Products
9 products
  • LOCTITE DA 100
    Not Available

    LOCTITE DA 100

    • Sn91.5/Sb8.5 - Pb free 92A Alloy
    • Semiconductor die attach
    • Excellent dispense capabilities
      Not Available
  • LOCTITE HF 250DP
    Not Available

    LOCTITE HF 250DP

    • 95.5%Sn: 3.8%Ag:0.7%Cu - 96SC Alloy
    • Lead free Soldering
    • Suitable for reflow in nitrogen
      Not Available
  • LOCTITE GC 10
    Not Available

    LOCTITE GC 10

    • SAC 305 - No refrigeration
    • PCB Assembly
    • Stencil Printable
      Not Available
  • LOCTITE GC 18 No refrigeration solder paste
    Not Available

    LOCTITE GC 18

    • SAC 305 - No refrigeration
    • Low voiding
    • Stencil Printable
      Not Available
  • LOCTITE GC 50
    Not Available

    LOCTITE GC 50

    • SAC 305 - No refrigeration
    • Low voiding
    • Fine nozzle Jet dispensing
      Not Available
  • LOCTITE HF 212
    Not Available

    LOCTITE HF 212

    • 90ISC and 97SC Alloys
    • Halogen free
    • Stencil Printable
      Not Available
  • LOCTITE LF 318
    Not Available

    LOCTITE LF 318

    • 90iSC Alloy
    • Automotive reliability qualified
    • Stencil Printable
      Not Available
  • Catalog Product

    LINQALLOY Bi57Sn42Ag1| Solder paste

    • Sn42Bi57Ag1 Alloy
    • 138°C Eutectic
    • Powder size: T3 (25-45um) and T4 (20-38um)
    • 12 weeks
  • LOCTITE MSC-01
    Not Available

    LOCTITE MSC-01

    • Cleaner
    • Solder paste processes
    • Manual and automatic operations
      Not Available
Compare Products
9 products

Product Selector Guide

Solder pastes
Product Description Alloy Particle size distribution Viscosity  (mPA.s) Melting temperature Shelf life
Dispensable
DA 100 Tin antimony, dispense solder paste for Die attach 92A Type 4 300,000 242°C 12 months at -20°C
GC 50 Room temp stable, Jet dispensable and fine particle paste for small components SAC305 Type 5 110,000 217°C  180 days in RT
Printable
Loctite GC 10 Room temp stable, Multi purpose solder paste for PCB assembly SAC305 Type 3, 4, 5 200,000 217°C 12 months in RT
Loctite GC 18 Room temp stable, low voiding paste for large area components such as QFN with heat sink. SAC305  Type 4 250,000 217°C 180 days in RT
Loctite HF 212 Refrigerated, Halogen-free, solder paste for PCB assembly 90iSC
97SC
Type 4 175,000 205 - 218°C 180 days at 0°C - 10°C
Loctite LF 318 Refrigerated, High reliability solder paste for PCB assembly. Both printable and dispensable versions. 90iSC Type 3 650,000 205 - 218°C 180 days at 0°C - 10°C


Learn More

Solder is frequently used as an alternative to conventional die attach paste when the application calls for high thermal and electrical performance. As leadframe-based devices such as SOICs, TSOPs and TSSOPs are often exposed to high temperatures during subsequent board assembly processing, high melt point alloys are important. Optimized rheology allows for printing or dispensing depending on process preferences and advanced flux technology is compatible with a wide range of reflow profiles to enable alloy adaptation when required.

Proper solder alloy formulation is vital for laminate-based packages, as the melting point must be tightly controlled to maintain the integrity of the organic substrate. Awardwinning halogen-free, lead-free solder paste materials offer low-voiding performance and can be processed at lower reflow temperatures to align with the requirements of wirebond laminate package processing.

Solder Alloys

There are multiple types of Alloys that can be used for a wide variety of applications. Different companies tend to use different codes and abbreviations for the same alloy but at the end of the day it all comes down to the alloy composition. So don't get confused by the branding and tradenames and just focus on the metal content and the end properties. In the following table you can see the codes Henkel is using for some popular alloys.

Solder Alloy Properties
Code Alloy Melting point (°C) Density point (g/cm3) Electrical resistivity Thermal conductivity (W/m-K)
2.5S Pb92.5/Sn05/Ag2.5 287-296 11.02 0.2 44
90iSC (High-Reliability) SAC387/Bi3/Sb1.5/Ni0.02 209-217 7.38 0.132 58
92A Sn91.5/Sb8.5 235-243 7.25 0.145 28
95A Sn95/Sb5 236-240 7.25 0.145 28
96S Sn96.5/Ag3.5 221 7.37 0.123 55
SAC0307 Sn99/0.7Cu/0.3Ag 217-228 7.33 0.15 64
SAC305* SAC305 or Sn96.5/Ag3.0/Cu0.5 217 7.338 0.132 58
SAC387** SAC387 or Sn95.5/Ag3.8/Cu0.7 217 7.44 0.132 60