Solder Pastes
We offer a portfolio of solder die attach pastes that deliver the process flexibility, thermal performance, high reliability and ease of use that modern power device manufacturers demand. They provide the thermal management necessary for today’s smaller outline, higher functioning semiconductor power devices, while also delivering the processability and versatility associated with solder paste materials.
Optimized rheology allows for printing or dispensing depending on process preferences and advanced flux technology is compatible with a wide range of reflow profiles to enable alloy adaptation when required. These products offer robust options for application-specific thermal requirements and overcome many of the issues historically associated with alternative products.
LOCTITE DA 100
- Sn91.5/Sb8.5 - Pb free 92A Alloy
- Semiconductor die attach
- Excellent dispense capabilities
- Not Available
LOCTITE HF 250DP
- 95.5%Sn: 3.8%Ag:0.7%Cu - 96SC Alloy
- Lead free Soldering
- Suitable for reflow in nitrogen
- 12 weeks
LINQALLOY Bi57Sn42Ag1| Solder paste
- Sn42Bi57Ag1 Alloy
- 138°C Eutectic
- Powder size: T3 (25-45um) and T4 (20-38um)
- 12 weeks
Product Selector Guide
Product | Description | Alloy | Particle size distribution | Viscosity (mPA.s) | Melting temperature | Shelf life |
---|---|---|---|---|---|---|
Dispensable | ||||||
DA 100 | Tin antimony, dispense solder paste for Die attach | 92A | Type 4 | 300,000 | 242°C | 12 months at -20°C |
GC 50 | Room temp stable, Jet dispensable and fine particle paste for small components | SAC305 | Type 5 | 110,000 | 217°C | 180 days in RT |
Printable | ||||||
Loctite GC 10 | Room temp stable, Multi purpose solder paste for PCB assembly | SAC305 | Type 3, 4, 5 | 200,000 | 217°C | 12 months in RT |
Loctite GC 18 | Room temp stable, low voiding paste for large area components such as QFN with heat sink. | SAC305 | Type 4 | 250,000 | 217°C | 180 days in RT |
Loctite HF 212 | Refrigerated, Halogen-free, solder paste for PCB assembly | 90iSC 97SC | Type 4 | 175,000 | 205 - 218°C | 180 days at 0°C - 10°C |
Loctite LF 318 | Refrigerated, High reliability solder paste for PCB assembly. Both printable and dispensable versions. | 90iSC | Type 3 | 650,000 | 205 - 218°C | 180 days at 0°C - 10°C |
Learn More
Solder is frequently used as an alternative to conventional die attach paste when the application calls for high thermal and electrical performance. As leadframe-based devices such as SOICs, TSOPs and TSSOPs are often exposed to high temperatures during subsequent board assembly processing, high melt point alloys are important. Optimized rheology allows for printing or dispensing depending on process preferences and advanced flux technology is compatible with a wide range of reflow profiles to enable alloy adaptation when required.
Proper solder alloy formulation is vital for laminate-based packages, as the melting point must be tightly controlled to maintain the integrity of the organic substrate. Awardwinning halogen-free, lead-free solder paste materials offer low-voiding performance and can be processed at lower reflow temperatures to align with the requirements of wirebond laminate package processing.
Solder Alloys
There are multiple types of Alloys that can be used for a wide variety of applications. Different companies tend to use different codes and abbreviations for the same alloy but at the end of the day it all comes down to the alloy composition. So don't get confused by the branding and tradenames and just focus on the metal content and the end properties. In the following table you can see the codes Henkel is using for some popular alloys.
Code | Alloy | Melting point (°C) | Density point (g/cm3) | Electrical resistivity | Thermal conductivity (W/m-K) |
---|---|---|---|---|---|
2.5S | Pb92.5/Sn05/Ag2.5 | 287-296 | 11.02 | 0.2 | 44 |
90iSC (High-Reliability) | SAC387/Bi3/Sb1.5/Ni0.02 | 209-217 | 7.38 | 0.132 | 58 |
92A | Sn91.5/Sb8.5 | 235-243 | 7.25 | 0.145 | 28 |
95A | Sn95/Sb5 | 236-240 | 7.25 | 0.145 | 28 |
96S | Sn96.5/Ag3.5 | 221 | 7.37 | 0.123 | 55 |
SAC0307 | Sn99/0.7Cu/0.3Ag | 217-228 | 7.33 | 0.15 | 64 |
SAC305* | SAC305 or Sn96.5/Ag3.0/Cu0.5 | 217 | 7.338 | 0.132 | 58 |
SAC387** | SAC387 or Sn95.5/Ag3.8/Cu0.7 | 217 | 7.44 | 0.132 | 60 |