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LOCTITE GC 18

Harmonization Code : 8001.20 |   Unwrought tin: Tin alloys
Main features
  • SAC 305 - No refrigeration
  • Low voiding
  • Stencil Printable

Product Description

LOCTITE GC 18 is a halogen free, no-clean, low voiding, Pb-free, SAC305 solder paste specially formulated to provide low voiding when soldering Bottom-Terminated Components (BTC- QFN, DPAK and LGA). This material is a room temperature paste, designed to enhance stability in stencil printing applications.

LOCTITE GC 18 offers less than 25% voiding across small and large BTC with an IPC Class III voiding for BGA/CSP. It has good resistance to graping (the appearance of unreflowed solder particles on top of the solder mass) in demanding reflow profiles, excellent humidity resistance and minimal slump at room temperature and up to 190°C.

LOCTITE GC 18 offers stable on-stencil viscosity for improved printing consistence and great reliability, passing SIR and ECM independent of reflow profiles. It leaves pin-testable post-reflow residues after four reflow cycles, is compatible with approved encapsulant technologies and  RoHS and EICC compliant.

Product Family
GC18  
0.5Kg Jar
T4

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Alloy Type
Alloy Type
A metallic element type
 SAC305
Metal Loading
Copper (Cu)
Copper (Cu)
Copper is a soft malleable and ductile metal with a very high thermal and electrical conductivity.
 0.5 %
Silver (Ag) 3 %
Tin (Sn) 96.5 %
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 25°C 180 days
Physical Properties
Thixotropic index
Thixotropic index
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten.

A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads.

It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.
 0.5
Viscosity
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
 250000 mPa.s
Thermal Properties
Melting Temperature
Melting temperature 217 °C

Additional Information

Storage:
Optimal storage: 5 to 25°C (41 to 77°F)
Please refer to the LOCTITE GC 18 Handling Guideline for further information on storage conditions.


Shelf Life:
Provided that LOCTITE GC 18 is stored in the original container, shelf life of 180 days at 5 to 25 ̊C (41 to 77°F) can be expected.