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LOCTITE HF 212 solder paste is a halogen-free (no intended added halogen in formulation), no clean, low voiding Pb-free solder paste for PCB assembly. It is ideal for printing, with a fine pitch capability (0.3 mm), stencil life (>8 hours), and abandon time (>4 hours) that are suitable for high-speed printing up to 150 mm/s. Additionally it is solderable on challenging surface finishes (CuNiZn and Copper OSP) and leaves clear residues for easy post-reflow inspection.
LOCTITE HF 212 shows excellent solderability when reflowed in both air and nitrogen across a wide range of challenging surface finishes including immersion Ag, OSP-Cu, ENIG and CuNiZn.It is suitable for use with industry standard SAC ,high reliability SAC and low silver alloys SAC. It uses a halogen-free flux that passes IC with pretreatment IPC-TM-650 2.3.34/EN14582 and has a classification of ROL0 to ANSI/J-STD-004 Rev.B
Please note that HF 212 comes in multiple alloys and powder types. The specifications below are for 90iSC Alloy. Please advise the TDS for additional information.
Solder Alloys (J-STD 006)