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- LINQALLOY SP-PSA525 | No Clean Solder Paste
LINQALLOY SP-PSA525 | No Clean Solder Paste
- Superior wetting
- Reliable clog-free dispensing
- High thermal fatigue resistance for power semiconductor applications
Product Description
LINQALLOY SP-PSA525 is a high-lead, no clean solder paste composed of 5% Sn, 92.5% Pb, and 2.5% Ag. It has been designed for die-attach processes (custom viscosity and particle size) and allows reliable, clog-free dispensing of consistent deposits with automated dispensing equipment. Using a high-temperature alloy, this product is able to give superior wetting capabilities and gives high solder joint strength. This solder paste is suitable for power semiconductor die attach applications.
LINQALLOY SP-PSA525 solder paste is being offered as a no-clean solder paste. No-clean solder paste is designed for applications where post-soldering cleaning is unnecessary, providing minimal, non-conductive residues. It comes with both ROL0 and ROL1 flux types.
Technical Specifications
| Thermal Properties | |||||
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| Chemical Properties | |||||
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| Physical Properties | |||||
| Viscosity Viscosity Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application | 130 – 170 mPa.s | ||||
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| General Properties | |||||
| Alloy Type Alloy Type A metallic element type | Sn5Pb92..5Ag2.5 | ||||
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