LINQALLOY SP-SAC305 | Solder paste

Harmonization Code : 8001.20 | Unwrought tin: Tin alloys

Main features

Sn96.5Ag3.0Cu0.5
217°C Eutectic
Powder size: T3 and T4

Product Description

LINQALLOY SP-SAC305 is a lead free, no clean, solder paste that has been designed for Surface Mount Technology(SMT). SP-SAC305 is available in 4 different options: SP-SAC305NC, SP-SAC305RMA, SP-SAC305RA and SP-SAC305WS.

LINQALLOY SP-SAC305-NC is designed for applications where post-soldering cleaning is unnecessary, providing minimal, non-conductive residues.This solder paste is crafted with refined tin powder that allows for exceptional printing capabilities and minimal oxide content.
This solder paste has enhanced flux content (higher %) that guarantees higher reliability. With is low iconic activator system it leaves behind minimal residues post reflow resulting in exceptionally high insulation resistance and excellent reliability.

LINQALLOY SP-SAC305-RMA is ideal for applications where minimal residue is acceptable, without the need for rigorous cleaning.This solder paste is crafted with refined tin powder that allows for exceptional printing capabilities and minimal oxide content.
This solder paste has enhanced flux content (higher %) that guarantees higher reliability. With is low iconic activator system it leaves behind minimal residues post reflow resulting in exceptionally high insulation resistance and excellent reliability.

LINQALLOY SP-SAC305-RA offers good wetting properties and versatility for a wide range of applications. This solder paste is crafted with refined tin powder that allows for exceptional printing capabilities and minimal oxide content. This solder paste has enhanced flux content (higher %) that guarantees higher reliability. With its low iconic activator system it leaves behind minimal residues post reflow resulting in exceptionally high insulation resistance and excellent reliability.

LINQALLOY SP-SAC305-WS is crafted with refined tin powder that allows for exceptional requirement to clean flux residue left after the reflow process. The removal of the solder flux is crucial for certain high risk application to ensure the PCB board is free
from elements which can cause problems. This solder paste has enhanced flux content (higher %) that guarantees higher reliability, with low iconic activator system.

Product Family
SP-SAC305

1. Select Package Type

NC | T4 Powder WS | T4 powder RMA | T3 powder

2. Available Package Size

0.5Kg Jar

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Shortest leadtime

Contact for Pricing

Packaging

TDS, SDS & Technical documents

Specifications
Additional Information

Technical Specifications

General Properties

Metal Loading
Copper (Cu) Copper (Cu) Copper is a soft malleable and ductile metal with a very high thermal and electrical conductivity.	0.5 %
Silver (Ag)	3 %
Tin (Sn)	96.5 %

Shelf Life Shelf Life Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties. It differs vastly per product and it is based on temperature and storage conditions. The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C	180 days

Physical Properties

Viscosity

Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application

200±20 mPa.s