Harmonization Code : 8001.20 |   Unwrought tin: Tin alloys
Main features
  • 90iSC Alloy
  • Automotive reliability qualified
  • Stencil Printable

Product Description

LOCTITE LF 318 solder paste is a halide-free, no clean, pin testable Pb-free solder paste, formulated to have excellent humidity resistance and a broad process window, both for reflow and printing. This product has high tack force to resist component movement during high speed placement and long printer abandon times.

LOCTITE LF 318 shows excellent solderability over a wide range of reflow profiles in both air and nitrogen across a wide range of surface finishes including Ni/Au, Immersion Sn, Immersion Ag, OSP copper. It leaves colorless and soft, non stick residues for easy post reflow inspection and in-circuit testing.

LOCTITE LF 318 should not be used to solder to component or PCB finishes containing lead (Pb), as a low melting eutectic (at 98°C) will form. It is suitable for fine pitch, high speed printing and pneumatic dispensing.

LOCTITE LF 318 contains a modified Pb-free solder alloy developed in a co-operative project for improved reliability as compared with standard SAC alloys, with a standard flux medium , LF 318.

Product Family
90 iSC
0.5Kg Jar 30cc Syringe

No longer available

This product is no longer available or will become obsolete soon. Please contact us so we can recommend an alternative product.

Technical Specifications

General Properties
Alloy Type
Alloy Type
A metallic element type
Metal Loading
Bismuth (Bi)
Bismuth (Bi)
Bismuth is a chemical element with symbol Bi and atomic number 83. Bismuth is the most naturally diamagnetic element, and has one of the lowest values of thermal conductivity among metals.
3 %
Copper (Cu)
Copper (Cu)
Copper is a soft malleable and ductile metal with a very high thermal and electrical conductivity.
0.7 %
Silver (Ag) 3.8 %
Tin (Sn) 90.95 %
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C 180 days
Physical Properties
Thixotropic index
Thixotropic index
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten.

A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads.

It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
650,000 mPa.s
Thermal Properties
Melting Temperature
Melting temperature 205 - 218 °C

Additional Information

Solder Alloys (J-STD 006)

Code Allloy Melting point Ag%
SAC0307 Low Silver 217 to 226 0.3
90iSC High Reliability 205 to 218 3.8
96S Industry Standard 221 3.5
96SC Industry Standard 217 3.8
97SC Industry Standard 217 3.0