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LOCTITE ECCOBOND UF 8806G high flow, liquid encapsulant is designed to improve the thermal cycling and reliability performance of ceramic flip chip devices. It is formulated using a proprietary Moisture Resistant Cyanate Estser (MRCE) resin.
LOCTITE ECCOBOND UF 8806G will reduce thermal stress between substrate and chip interconnects. It will form a hard black colored polymer when sufficiently cured. This material is designed to achieve JEDEC Level 1 reliability standards with ceramic substrates