Product Description
LOCTITE ECCOBOND UF 8806G high flow, liquid encapsulant is designed to improve the thermal cycling and reliability performance of ceramic flip chip devices. It is formulated using a proprietary Moisture Resistant Cyanate Estser (MRCE) resin.
LOCTITE ECCOBOND UF 8806G will reduce thermal stress between substrate and chip interconnects. It will form a hard black colored polymer when sufficiently cured. This material is designed to achieve JEDEC Level 1 reliability standards with ceramic substrates
Cure Schedule
- 45 minute ramp to 195°C + 60 minutes @ 195°C
- 30 minute ramp to 165°C + 180 minutes @ 165°C