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LOCTITE® ECCOBOND FP4526 epoxy underfill is designed for capillary flow on flip chip applications. It's fast flow and low viscosity along with its excellent wettability and adhesion make it ideal for high reliability applications.
LOCTITE® ECCOBOND FP4526 is a heat curable 63% filled underfill that can be used on ceramic, organic, solder mask and polyimide substrates and is typically used for Ceramic packages and FC on flex applications. Cure Schedule