LOCTITE ECCOBOND FP4527
- Low viscosity
- High flow
- Excellent wettability
LOCTITE® ECCOBOND FP4527 epoxy underfill has excellent wettability and is typically used on a semiconductor level as a capillary underfill.
LOCTITE® ECCOBOND FP4527 is a low viscosity, high flow, epoxy based material designed for capillary underfill on flip chip applications.
- 15 minutes @ 165°C (hot plate)
- 30 minutes @ 165°C (convection)
- 1hour @110°C + 30 minutes @150°C (convection)
|Filler Content||68 %|
| Pot Life |
Pot life is the amount of time it takes for the viscosity of a material to double (or quadruple for lower viscosity materials) in room temperature after a material is mixed.
It is closely related to work life but it is not application dependent, less precise and more of a general indication of how fast a system is going to cure.
| Viscosity |
Viscosity is a measurement of a fluid’s resistance to flow.
Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.
A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
|Moisture absorption||1.5 %|
| Glass Transition Temperature (Tg) |
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.
The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.