Product Description
LOCTITE® ECCOBOND FP4527 epoxy underfill has excellent wettability and is typically used on a semiconductor level as a capillary underfill.
LOCTITE® ECCOBOND FP4527 is a low viscosity, high flow, epoxy based material designed for capillary underfill on flip chip applications.
Cure Schedule
- 15 minutes @ 165°C (hot plate)
- 30 minutes @ 165°C (convection)
- 1hour @110°C + 30 minutes @150°C (convection)