LOCTITE ECCOBOND UF4550HTC
- Thermally conductive
- Low ionics
- Alumina filled
LOCTITE ECCOBOND UF 4550HTC is a board level capillary underfill designed to provide enhanced thermal properties and adhesion to integrated circuit passivation material and flex circuits. LOCTITE ECCOBOND UF 4550HTC is designed to quickly underfill at elevated substrate temperature of 90 to 110°C.
LOCTITE ECCOBOND UF 4550HTC provides thermal conductivity for applications where thermal management is required. This material is also engineered to provide good thermal cycle reliability for PCBAs.
- 15 minutes @ 160°C
| Specific Gravity |
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.
For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
| Thixotropic index |
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten.
A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads.
It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.
| Viscosity |
Viscosity is a measurement of a fluid’s resistance to flow.
Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.
A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
|Moisture absorption||0.5 %|
| Glass Transition Temperature (Tg) |
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.
The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
| Thermal Conductivity |
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.
Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.