Loctite FP4804 | Epoxy Underfill


Main features
  • Good flowability
  • Low CTE/modulus (reduced stress)
  • No resin bleed out on glass

Product Description

LOCTITE ECCOBOND FP 4804 is a high-performance, silver-free epoxy underfill material developed to deliver improved adhesion and reduced stress in electronic packaging. Based on the same chemistry as the popular FP4802, FP 4804 builds on its predecessor with a higher filler content (78%), resulting in a significantly lower coefficient of thermal expansion (CTE) and modulus—crucial for minimizing thermal stress.

With a cohesive failure mode in die shear testing and zero resin bleed on glass substrates, LOCTITE ECCOBOND FP 4804 ensures high-reliability bonding and a clean finish, even in precision applications. It also features a robust dispense profile that remains stable during extended work periods, making it ideal for use with jet dispensing systems.

Applications

  • Underfill for flip-chip and BGA components
  • Semiconductor packaging requiring high adhesion and low CTE
  • Automotive-grade electronics meeting AEC Grade 1 standards
  • Jet dispensing processes for fine-feature electronics
Product Family
FP4804  
30cc syringe

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 8 - 12 weeks Shipping in 8 - 12 weeks Shipping in 8 - 12 weeks

Technical Specifications

General Properties
Filler Content 78 %
Pot Life
Pot Life
Pot life is the amount of time it takes for the viscosity of a material to double (or quadruple for lower viscosity materials) in room temperature after a material is mixed.

It is closely related to work life but it is not application dependent, less precise and more of a general indication of how fast a system is going to cure.
24 hours
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
1.84
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ -40°C 274 days
Physical Properties
Viscosity
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
102000 mPa.s
Chemical Properties
Ionic Content
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
10 ppm
Potassium (K+)
Potassium (K+)
The amount of Potassium (K+) ion extracted from the product in parts per million (ppm)
5 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
5 ppm
Moisture absorption 0.3 %
Mechanical Properties
Storage (DMA) Modulus
Storage (DMA) Modulus @ 25°C 20000 N/mm2
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE) , α1
Coefficient of Thermal Expansion (CTE) , α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
15 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
53 ppm/°C
Gel Time
Gel Time
Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable.

It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 121°C / 250°F 7 minutes
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
51 °C

Additional Information

Cure schedule

Recommended cure condition
• 30 min ramp to 100°C, soak 2hrs at 100°C, then ramp 30min to 150°C, soak 1hr at 150°C
Alternate cure condition
• 30 min ramp to 100°C, soak 1hr at 100°C, then ramp 30min to 150°C, soak 2hrs at 150°C


Bleeding test FP4802 & FP4804

Bleeding test FP4802 vs FP4804


Die Shear test FP4802 & FP4804

Die Shear test FP4802 vs FP4804 on BT substrate


Printing and dispensing

Dispense test (jetting)
Jetting dispense test FP4804
Dispense worklifeDispense work-life FP4804

Isothermal viscosity
Isothermal viscosity FP4804
Viscosity vs temperature
Viscosity vs temperature FP4804

TMA
TMA graph data FP4804
DMA
DMA graph data FP4804

DSC
DSC graph data FP4804
DVS
DVS graph data FP4804

Thawing (if applicable)
1. Allow container to reach room temperature before use.
2. After removing from freezer, set the syringes to stand vertically while thawing.
3. Do not open the container before contents reach 22°C temperature. Moisture that collects on the thawed container should be removed prior to opening the container.
4. Do not re-freeze. Once thawed to 22°C, the adhesive should not be re-frozen.