Specialty Chemicals, Adhesives & Plastics
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LOCTITE ECCOBOND UF 8807 is formulated using a novel moisture Resistant Cyanate Ester (MRCE) chemistry. This material's characteristics help to reduce thermal and mechanical stresses between CSP packages and HDI substrates in MPM applications on organic substrates. It is silica filled with 63.5% solids content.
LOCTITE ECCOBOND UF 8807 is an electrically insulating, semiconductor level capillary underfill that offers excellent flow characteristics for high density arrays. An optimized particle size distribution allows LOCTITE ECCOBOND UF 8807 adhesive to flow rapidly into gaps of 10 mil and greater to form a protective polymer when cured.