Product Description
LOCTITE® ABLESTIK 8008HT adhesive is designed for high power devices in high UPH environment. It offers a lead-free alternative to soft solder and eutectic and can potentially reduce the layers of backside metallization required. This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. The adhesive can then be cured after die attach in an in-line process exhibiting a consistent, void-free bondline without bleed.
LOCTITE ABLESTIK 8008HT should be used with a pressure sensitive dicing tape and is not compatible with UV dicing tapes. This hybrid chemistry product is thermally and electrically conductive and can be snap cured after B-stage.
Cure Schedule
- 20 seconds @ 170°C. (Snap Cure)
- 30 minutes ramp to 175°C + 60 minutes @ 175°C (Air box oven Cure)