Hysol GR750 | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.40 |   Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
  • For SiC, GaN semiconductors
  • Very High Tg: 235°C
  • Excellent adhesion to Nickel (Ni) leadframes

Product Description

Hysol GR750 is a halogen free, black, silica filled (75um cut size) semiconductor grade epoxy molding compound. It offers an extremely high Tg (235°C) along with low moisture absorption, low viscosity and excellent adhesion to Nickel (Ni) leadframes, only to be beaten by GR750 X1 (194N tab pull). The GR750 product series has been developed with 3rd generation semiconductors in mind and is the product of choice for Silicon Carbide (SiC) and Gallium Nitride (GaN) packages.

Hysol GR750 is a technologically advanced green epoxy molding compound with excellent electrical performance, designed for high power devices especially for high temperature application with low moisture absorption requirements. It delivers outstanding performance and ease of use. It meets UL 94 V-0 flammability at 1/8 inch thickness.

Product Family
GR750  
Pellet
40 mm 14 mm
60 gr 4.4 gr
15 kg 10 kg

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Technical Specifications

General Properties
Color
Color
The color
Black
Physical Properties
Spiral Flow @ 175°C 106 cm
Chemical Properties
Ionic Content
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
15 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
15 ppm
Moisture absorption 0.35 %
Mechanical Properties
Flexural Modulus
Flexural Modulus @ 25°C 16880 N/mm2
Flexural Strength
Flexural Strength @ 25°C
Flexural Strength @ 25°C
Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C
138 N/mm2
Water Extract Data
Water Extract Data
Water Extract Data, 20hrs water boil
pH of extract 6
Storage (DMA) Modulus
Storage (DMA) Modulus @ 260°C 1658 N/mm2
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
3.3x1016 Ohms⋅cm
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
10 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
40 ppm/°C
Gel Time
Gel Time
Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable.

It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F 26 s
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
235 °C
UL 94 Rating
UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole
V0
Curing Conditions
Curing Schedule
Curing Schedule
Curing schedule is the time and temperature required for a mixed material to fully cure. While this applies to materials that cure with heat, there are also other materials that can be cured with UV.

Even though some materials can cure on ambient temperatures, others will require elevated temperature conditions to properly cure.

There are various curing schedules depending on the material type and application. For heat curing, the most common ones are Snap cure, Low temperature cure, Step cure and Staged cure.

Recommended cure type, schedule, time and temperature can always be found on the Technical data sheets.
Curing Time @ 175°C / 347°F 90 s
Mold Temperature 180 °C

Additional Information

 

GR750 EMC for High Power & Voltage SiC Devices

 

Product Comparison Table

Product Name

MG15F-MOD2

MG15F-0140

GR750 (Std)

GR750 X1 (Std)

GR750X1
(low CTE)

GR720X2 (Std)

GR750 X2FF
fine filler

GR720X2

 (high CTE)

Epoxy type

-

OCN/BisA/DCPD

OCN/BisA

MFN

MFN/L.W.A.

MFN/L.W.A.

MFN/L.W.A.

MAR

MAR/L.Vis.

Hardener type

-

Anhydride

Anhydride

New

New

New

New

New

New

Filler cut size

µm

106

150

75

75

75

75

45

75

Flammability

UL-94

V-0 at ¼”

V-0 at 1/8''

V-0 at 1/8''

V-0 at 1/8''

V-0 at 1/8''

V-0 at 1/8''

V-0 at 1/8''

V-0 at 1/8''

Spiral Flow

inches

36

20

42

36

26

45

40

41

Gel Time

sec

32

17

26

24

29

30

30

35

Viscosity @ 175°C

PaS

20

28

10

13

43

25

20

15

Tg by TMA

oC

242

195

225

202

197

170

182

170

CTE 1

ppm/°C

16

21

10

8

6

9

9

14

CTE 2

ppm/°C

49

70

40

42

31

35

32

40

DMA Storage Modulus at RT

MPa

18246

14078

20560

23155

29241

21631

23391

20971

DMA Storage Modulus at 260C

MPa

6491

1883

1658

1713

1711

907

1007

961

Tg by DMA Tanδ Peak

0C

270

217

235

207

200

177

182

177

Flexural modulus

Mpa

16312

12449

16880

18042

21469

17470

17549

16900

Flexural strength

Mpa

120

126

138

136

134

152

169

150

Moisture absorption PCT24h

%

0.55

0.65

0.35

0.3

0.2

0.2

0.2

0.2

Cl-/ Na+

ppm

<10

<10

<15

<15

<15

<15

<15

<15

PH

 

4~6

4~6

5~7

5~7

5~7

5~7

5~7

5~7

Volume resistivity @21C & 500V

Ω.cm

2.4E+16

6.3E+16

3.3E+16

1.7E+16

1.0E+16

1.6E+16

1.8E+16

1.0E+16

Dielectric constant, 21 C & 1MHz

 

3.6

3.7

3.7

3.7

3.7

3.8

3.8

3.9

Adhesion (tabpull) after MSL3

on Cu

N

344

136

365

406

307

360

407

331

on Ag

N

235

NA

345

363

269

234

348

415

on Ni

N

84

111

170

194

130

104

102

110

Comparative Tracking Index

V

600

400

600

600

600

600

600

600

Recommended Molding condition

190°C110s

180°C100s

180°C 90s

180°C 90s

180°C 90s

180°C 90s

180°C 90s

180°C 90s

Recommended PMC condition

190°C 3~6hrs

190°C 3~6hrs

190°C10hrs

190°C10hrs

190°C10hrs

190°C10hrs

190°C10hrs

190°C10hrs

 

 

DETA Data for the GR7XX product line

DMA and TMA curves of GR750 (Standard)