Hysol GR750 X2 | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide

Hysol GR750 X2 | Black Epoxy Mold Compound

Main features

Low moisture absorption
High Tg: 182°C
For high temperature applications

Product Description

Hysol GR750 X2 is a halogen free, black, silica filled (75um cut size) semiconductor grade epoxy molding compound. It has good pull tab adhesion on Copper (429 N) and very High Tg (182 °C). The entire GR75XX product line is alterations to the same formulation to fit everybody's needs and X2 leans towards High Tg. The product is still in active development so some properties might end up higher or lower depending on the state of the final formulation.

Hysol GR750 X2 is a technologically advanced, non anhydride, green epoxy molding compound with excellent electrical performance, designed for high power devices especially for high temperature application with low moisture absorption requirements. Typical packages can be TO220, ZIP, PentaWatts, Heptawatts and TDA series packages. It delivers outstanding performance and ease of use and it meets UL 94 V-0 flammability at 1/8 inch thickness.

Specifications
Additional Information

Technical Specifications

General Properties

Color

Color
The color

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

1.94

Shelf Life Shelf Life Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties. It differs vastly per product and it is based on temperature and storage conditions. The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C	183 days

Physical Properties

Spiral Flow @ 175°C

114 cm

Chemical Properties

Ionic Content
Chloride (Cl-) Chloride (Cl-) The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)	15 ppm
Sodium (Na+) Sodium (Na+) The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)	5 ppm

Moisture absorption

0.3 %

Mechanical Properties

Flexural Modulus
Flexural Modulus @ 25°C	17549 N/mm2

Flexural Strength
Flexural Strength @ 25°C Flexural Strength @ 25°C Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C	169 N/mm2

Storage (DMA) Modulus
Storage (DMA) Modulus @ 25°C	23391 N/mm2

Electrical Properties

Volume Resistivity

Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.

1.5x10¹⁶ Ohms⋅cm

Thermal Properties

Coefficient of Thermal Expansion (CTE) Coefficient of Thermal Expansion (CTE) CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material. Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1 Coefficient of Thermal Expansion (CTE), α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	9 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	32 ppm/°C

Gel Time Gel Time Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable. It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F	27 s

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

182 °C

Thermal Conductivity

Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.

0.8 W/m.K

UL 94 Rating

UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole

Curing Conditions

Curing Schedule Curing Schedule Curing schedule is the time and temperature required for a mixed material to fully cure. While this applies to materials that cure with heat, there are also other materials that can be cured with UV. Even though some materials can cure on ambient temperatures, others will require elevated temperature conditions to properly cure. There are various curing schedules depending on the material type and application. For heat curing, the most common ones are Snap cure, Low temperature cure, Step cure and Staged cure. Recommended cure type, schedule, time and temperature can always be found on the Technical data sheets.
Curing Time @ 175°C / 347°F	90 - 120 s
Mold Temperature	175 - 200 °C
Preheat Temperature	80 - 100 °C

Post Mold Cure
Post Mold Cure @ 175°C / 347°F	6 - 12 hrs

Additional Information

Comparison of the entire GR7XXX product series

Product Name			MG15F-MOD2	MG15F-0140	GR750 (Std)	GR750 X1 (Std)	GR750X1 (low CTE)	GR720X2 (Std)	GR750 X2FF fine filler	GR720X2 (high CTE)
Epoxy type		-	OCN/BisA/DCPD	OCN/BisA	MFN	MFN/L.W.A.	MFN/L.W.A.	MFN/L.W.A.	MAR	MAR/L.Vis.
Hardener type		-	Anhydride	Anhydride	New	New	New	New	New	New
Filler cut size		µm	106	150	75	75	75	75	45	75
Flammability		UL-94	V-0 at ¼”	V-0 at 1/8''	V-0 at 1/8''	V-0 at 1/8''	V-0 at 1/8''	V-0 at 1/8''	V-0 at 1/8''	V-0 at 1/8''
Spiral Flow		inches	36	20	42	36	26	45	40	41
Gel Time		sec	32	17	26	24	29	30	30	35
Viscosity @ 175°C		PaS	20	28	10	13	43	25	20	15
Tg by TMA		oC	242	195	225	202	197	170	182	170
CTE 1		ppm/°C	16	21	10	8	6	9	9	14
CTE 2		ppm/°C	49	70	40	42	31	35	32	40
DMA Storage Modulus at RT		MPa	18246	14078	20560	23155	29241	21631	23391	20971
DMA Storage Modulus at 260C		MPa	6491	1883	1658	1713	1711	907	1007	961
Tg by DMA Tanδ Peak		0C	270	217	235	207	200	177	182	177
Flexural modulus		Mpa	16312	12449	16880	18042	21469	17470	17549	16900
Flexural strength		Mpa	120	126	138	136	134	152	169	150
Moisture absorption PCT24h		%	0.55	0.65	0.35	0.3	0.2	0.2	0.2	0.2
Cl-/ Na+		ppm	<10	<10	<15	<15	<15	<15	<15	<15
PH			4~6	4~6	5~7	5~7	5~7	5~7	5~7	5~7
Volume resistivity @21C & 500V		Ω.cm	2.4E+16	6.3E+16	3.3E+16	1.7E+16	1.0E+16	1.6E+16	1.8E+16	1.0E+16
Dielectric constant, 21 C & 1MHz			3.6	3.7	3.7	3.7	3.7	3.8	3.8	3.9
Adhesion (tabpull) after MSL3	on Cu	N	344	136	365	406	307	360	407	331
	on Ag	N	235	NA	345	363	269	234	348	415
	on Ni	N	84	111	170	194	130	104	102	110
Comparative Tracking Index		V	600	400	600	600	600	600	600	600
Recommended Molding condition			190°C110s	180°C100s	180°C 90s	180°C 90s	180°C 90s	180°C 90s	180°C 90s	180°C 90s
Recommended PMC condition			190°C 3~6hrs	190°C 3~6hrs	190°C10hrs	190°C10hrs	190°C10hrs	190°C10hrs	190°C10hrs	190°C10hrs