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Hysol GR750 X2 | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.40 |   Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
  • Low moisture absorption
  • High Tg: 182°C
  • For high temperature applications

Product Description

Hysol GR750 X2 is a halogen free, black, silica filled (75um cut size) semiconductor grade epoxy molding compound. It has good pull tab adhesion on Copper (429 N) and very High Tg (182 °C).  The entire GR75XX product line is alterations to the same formulation to fit everybody's needs and X2 leans towards High Tg. The product is still in active development so some properties might end up higher or lower depending on the state of the final formulation. 

Hysol GR750 X2 is a technologically advanced, non anhydride, green epoxy molding compound with excellent electrical performance, designed for high power devices  especially for high temperature application with low moisture absorption requirements. Typical packages can be  TO220, ZIP, PentaWatts, Heptawatts and TDA series packages. It delivers outstanding performance and ease of use and it meets UL 94 V-0 flammability at 1/8 inch thickness.

Product Family
GR750X2  
Pellet
14 mm
4.4 gr
10 kg

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 8 - 12 weeks Shipping in 8 - 12 weeks

Technical Specifications

General Properties
Color
Color
The color
Black
Filler Content 84 %
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
1.94
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C 183 days
Chemical Properties
Extractable Ionic Content, after 20 hours
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
15 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
5 ppm
Moisture Absorption
Moisture Absorption
Moisture absorption shows the capacity of a polymer to absorb moisture from its environment.

Absorbed moisture can reduce the glass transition temperature and strength of a polymer and can also result in popcorning, unreliable adhesion or voids in the bond line due to moisture desorption or entrapment.

Moisture absorption should always be mentioned with the test conditions to provide a meaningful frame of reference.
Moisture absorption - 168h @ 85ºC | 85% RH 0.3 %
Mechanical Properties
Flexural Modulus
Flexural Modulus @ 25°C 17549 N/mm2
Flexural Strength
Flexural Strength @ 25°C
Flexural Strength @ 25°C
Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C
169 N/mm2
Storage (DMA) Modulus
Storage (DMA) Modulus @ 25°C 23391 N/mm2
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
1.5x1016 Ohms⋅cm
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
9 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
32 ppm/°C
Gel Time
Gel Time
Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable.

It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F 27 s
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
182 °C
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
0.8 W/m.K
Spiral Flow
Spiral Flow @ 175°C 114 cm
UL94 Rating
UL94 @ 1/8 inch V0
Curing Conditions
Curing Time
Curing Time @ 175°C / 347°F 90 - 120 s
Mold Temperature 175 - 200 °C
Preheat Temperature 80 - 100 °C
Transfer Pressure 40 - 100 kg/cm2
Transfer Time 6 - 18 s
Post Mold Cure
Post Mold Cure @ 175°C / 347°F 6 - 12 hrs

Additional Information

 Comparison of the entire GR7XXX product series

 

Product Name

MG15F-MOD2

MG15F-0140

GR750 (Std)

GR750 X1 (Std)

GR750X1
(low CTE)

GR720X2 (Std)

GR750 X2FF
fine filler

GR720X2

 (high CTE)

Epoxy type

-

OCN/BisA/DCPD

OCN/BisA

MFN

MFN/L.W.A.

MFN/L.W.A.

MFN/L.W.A.

MAR

MAR/L.Vis.

Hardener type

-

Anhydride

Anhydride

New

New

New

New

New

New

Filler cut size

µm

106

150

75

75

75

75

45

75

Flammability

UL-94

V-0 at ¼”

V-0 at 1/8''

V-0 at 1/8''

V-0 at 1/8''

V-0 at 1/8''

V-0 at 1/8''

V-0 at 1/8''

V-0 at 1/8''

Spiral Flow

inches

36

20

42

36

26

45

40

41

Gel Time

sec

32

17

26

24

29

30

30

35

Viscosity @ 175°C

PaS

20

28

10

13

43

25

20

15

Tg by TMA

oC

242

195

225

202

197

170

182

170

CTE 1

ppm/°C

16

21

10

8

6

9

9

14

CTE 2

ppm/°C

49

70

40

42

31

35

32

40

DMA Storage Modulus at RT

MPa

18246

14078

20560

23155

29241

21631

23391

20971

DMA Storage Modulus at 260C

MPa

6491

1883

1658

1713

1711

907

1007

961

Tg by DMA Tanδ Peak

0C

270

217

235

207

200

177

182

177

Flexural modulus

Mpa

16312

12449

16880

18042

21469

17470

17549

16900

Flexural strength

Mpa

120

126

138

136

134

152

169

150

Moisture absorption PCT24h

%

0.55

0.65

0.35

0.3

0.2

0.2

0.2

0.2

Cl-/ Na+

ppm

<10

<10

<15

<15

<15

<15

<15

<15

PH

 

4~6

4~6

5~7

5~7

5~7

5~7

5~7

5~7

Volume resistivity @21C & 500V

Ω.cm

2.4E+16

6.3E+16

3.3E+16

1.7E+16

1.0E+16

1.6E+16

1.8E+16

1.0E+16

Dielectric constant, 21 C & 1MHz

 

3.6

3.7

3.7

3.7

3.7

3.8

3.8

3.9

Adhesion (tabpull) after MSL3

on Cu

N

344

136

365

406

307

360

407

331

on Ag

N

235

NA

345

363

269

234

348

415

on Ni

N

84

111

170

194

130

104

102

110

Comparative Tracking Index

V

600

400

600

600

600

600

600

600

Recommended Molding condition

190°C110s

180°C100s

180°C 90s

180°C 90s

180°C 90s

180°C 90s

180°C 90s

180°C 90s

Recommended PMC condition

190°C 3~6hrs

190°C 3~6hrs

190°C10hrs

190°C10hrs

190°C10hrs

190°C10hrs

190°C10hrs

190°C10hrs

 

 

DETA Data for the GR7XX product line