Product Description
Hysol GR750 X2 is a halogen free, black, silica filled (75um cut size) semiconductor grade epoxy molding compound. It has good pull tab adhesion on Copper (429 N) and very High Tg (182 °C). The entire GR75XX product line is alterations to the same formulation to fit everybody's needs and X2 leans towards High Tg. The product is still in active development so some properties might end up higher or lower depending on the state of the final formulation.
Hysol GR750 X2 is a technologically advanced, non anhydride, green epoxy molding compound with excellent electrical performance, designed for high power devices especially for high temperature application with low moisture absorption requirements. Typical packages can be TO220, ZIP, PentaWatts, Heptawatts and TDA series packages. It delivers outstanding performance and ease of use and it meets UL 94 V-0 flammability at 1/8 inch thickness.