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Hysol GR750 | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide

Main features

Halogen free
Very High Tg: 235°C
Excellent adhesion to Nickel (Ni) leadframes

Product Description

Hysol GR750 is a halogen free, black, silica filled (75um cut size) semiconductor grade epoxy molding compound. It offers an extremely high Tg (235°C) along with low moisture absorption, low viscosity and excellent adhesion to Nickel (Ni) leadframes, only to be beaten by GR750 X1 (194N tab pull).

Hysol GR750 is a technologically advanced green epoxy molding compound with excellent electrical performance, designed for high power devices especially for high temperature application with low moisture absorption requirements. It delivers outstanding performance and ease of use. It meets UL 94 V-0 flammability at 1/8 inch thickness.

Product Family
GR750

1. Select Product Form

Pellet

2. Available Pellet Size

40 mm 14 mm

3. Available Pellet Weight

60 gr 4.4 gr

4. Available Package Size

15 kg 10 kg

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Shortest leadtime

Contact for Pricing

Packaging

TDS, SDS & Technical documents

Specifications
Additional Information

Technical Specifications

General Properties

Color

Color
The color

Black

Chemical Properties

Ionic Content
Chloride (Cl-) Chloride (Cl-) The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)	15 ppm
Sodium (Na+) Sodium (Na+) The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)	15 ppm

Moisture Absorption

Moisture Absorption
Moisture absorption shows the capacity of a polymer to absorb moisture from its environment.

Absorbed moisture can reduce the glass transition temperature and strength of a polymer and can also result in popcorning, unreliable adhesion or voids in the bond line due to moisture desorption or entrapment.

Moisture absorption should always be mentioned with the test conditions to provide a meaningful frame of reference.

Moisture absorption - 168h @ 85ºC | 85% RH

0.35 %

Mechanical Properties

Flexural Modulus
Flexural Modulus @ 25°C	16880 N/mm2

Flexural Strength
Flexural Strength @ 25°C Flexural Strength @ 25°C Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C	138 N/mm2

Water Extract Data Water Extract Data Water Extract Data, 20hrs water boil
pH of extract	6

Storage (DMA) Modulus
Storage (DMA) Modulus @ 260°C	1658 N/mm2

Electrical Properties

Volume Resistivity

Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.

3.3x10¹⁶ Ohms⋅cm

Thermal Properties

Coefficient of Thermal Expansion (CTE) Coefficient of Thermal Expansion (CTE) CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material. Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1 Coefficient of Thermal Expansion (CTE), α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	10 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	40 ppm/°C

Gel Time Gel Time Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable. It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F	26 s

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

235 °C

Spiral Flow
Spiral Flow @ 175°C	106 cm

UL94 Rating
UL94 @ 1/8 inch	V0

Curing Conditions

Curing Time
Curing Time @ 175°C / 347°F	90 s

Mold Temperature

180 °C

Additional Information

GR750 EMC for High Power & Voltage SiC Devices

Product Comparison Table

Product Name			MG15F-MOD2	MG15F-0140	GR750 (Std)	GR750 X1 (Std)	GR750X1 (low CTE)	GR720X2 (Std)	GR750 X2FF fine filler	GR720X2 (high CTE)
Epoxy type		-	OCN/BisA/DCPD	OCN/BisA	MFN	MFN/L.W.A.	MFN/L.W.A.	MFN/L.W.A.	MAR	MAR/L.Vis.
Hardener type		-	Anhydride	Anhydride	New	New	New	New	New	New
Filler cut size		µm	106	150	75	75	75	75	45	75
Flammability		UL-94	V-0 at ¼”	V-0 at 1/8''	V-0 at 1/8''	V-0 at 1/8''	V-0 at 1/8''	V-0 at 1/8''	V-0 at 1/8''	V-0 at 1/8''
Spiral Flow		inches	36	20	42	36	26	45	40	41
Gel Time		sec	32	17	26	24	29	30	30	35
Viscosity @ 175°C		PaS	20	28	10	13	43	25	20	15
Tg by TMA		oC	242	195	225	202	197	170	182	170
CTE 1		ppm/°C	16	21	10	8	6	9	9	14
CTE 2		ppm/°C	49	70	40	42	31	35	32	40
DMA Storage Modulus at RT		MPa	18246	14078	20560	23155	29241	21631	23391	20971
DMA Storage Modulus at 260C		MPa	6491	1883	1658	1713	1711	907	1007	961
Tg by DMA Tanδ Peak		0C	270	217	235	207	200	177	182	177
Flexural modulus		Mpa	16312	12449	16880	18042	21469	17470	17549	16900
Flexural strength		Mpa	120	126	138	136	134	152	169	150
Moisture absorption PCT24h		%	0.55	0.65	0.35	0.3	0.2	0.2	0.2	0.2
Cl-/ Na+		ppm	<10	<10	<15	<15	<15	<15	<15	<15
PH			4~6	4~6	5~7	5~7	5~7	5~7	5~7	5~7
Volume resistivity @21C & 500V		Ω.cm	2.4E+16	6.3E+16	3.3E+16	1.7E+16	1.0E+16	1.6E+16	1.8E+16	1.0E+16
Dielectric constant, 21 C & 1MHz			3.6	3.7	3.7	3.7	3.7	3.8	3.8	3.9
Adhesion (tabpull) after MSL3	on Cu	N	344	136	365	406	307	360	407	331
	on Ag	N	235	NA	345	363	269	234	348	415
	on Ni	N	84	111	170	194	130	104	102	110
Comparative Tracking Index		V	600	400	600	600	600	600	600	600
Recommended Molding condition			190°C110s	180°C100s	180°C 90s	180°C 90s	180°C 90s	180°C 90s	180°C 90s	180°C 90s
Recommended PMC condition			190°C 3~6hrs	190°C 3~6hrs	190°C10hrs	190°C10hrs	190°C10hrs	190°C10hrs	190°C10hrs	190°C10hrs