Product Description
Hysol GR750 is a halogen free, black, silica filled (75um cut size) semiconductor grade epoxy molding compound. It offers an extremely high Tg (235°C) along with low moisture absorption, low viscosity and excellent adhesion to Nickel (Ni) leadframes, only to be beaten by GR750 X1 (194N tab pull). The GR750 product series has been developed with 3rd generation semiconductors in mind and is the product of choice for Silicon Carbide (SiC) and Gallium Nitride (GaN) packages.
Hysol GR750 is a technologically advanced green epoxy molding compound with excellent electrical performance, designed for high power devices especially for high temperature application with low moisture absorption requirements. It delivers outstanding performance and ease of use. It meets UL 94 V-0 flammability at 1/8 inch thickness.