Product Description
Hysol GR750 X1 is a halogen free, black, silica filled (75um cut size) semiconductor grade epoxy molding compound. It has amazing pull tab adhesion on Nickel (194 N) and very low CTE (8 ppm/°C). It's a very all around product that balances High Tg with low CTE and amazing adhesion. The entire GR75XX product line is alterations to the same formulation to the fit everybody's needs and X1 hits a balanced sweet spot. The product is still in active development so some properties might end up higher or lower depending on the state of the final formulation. There is also a Low CTE (6 ppm/°C) lab version lurking around. Contact us if you're interested.
Hysol GR750 X1 is a technologically advanced, non anhydride, green epoxy molding compound with excellent electrical performance, designed for high power devices especially for high temperature application with low moisture absorption requirements. Typical packages can be Silicon Carbide SiC MOSFETS packages in TO 247 and TO 263 among (us) others. Renewable energy, EV battery chargers, High voltage DC/DC converters and Switch Mode Power Supplies are only some of the applications where these packages can be used. GR750 X1 delivers outstanding performance and ease of use. It meets UL 94 V-0 flammability at 1/8 inch thickness.