• x

Hysol GR750 X1 | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.40 |   Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
  • Halogen free
  • Low CTE: 8 ppm/°C
  • Amazing adhesion to Nickel (Ni) leadframes

Product Description

Hysol GR750 X1 is a halogen free, black, silica filled (75um cut size) semiconductor grade epoxy molding compound. It has amazing pull tab adhesion on Nickel (194 N) and very low CTE (8 ppm/°C). It's a very all around product that balances High Tg with low CTE and amazing adhesion. The entire GR75XX product line is alterations to the same formulation to the fit everybody's needs and X1 hits a balanced sweet spot. The product is still in active development so some properties might end up higher or lower depending on the state of the final formulation. There is also a Low CTE (6 ppm/°C) lab version lurking around. Contact us if you're interested.

Hysol GR750 X1 is a technologically advanced, non anhydride, green epoxy molding compound with excellent electrical performance, designed for high power devices  especially for high temperature application with low moisture absorption requirements. Typical packages can be Silicon Carbide SiC MOSFETS packages in TO 247 and TO 263 among (us) others. Renewable energy, EV battery chargers, High voltage DC/DC converters and Switch Mode Power Supplies are only some of the applications where these packages can be used. GR750 X1 delivers outstanding performance and ease of use. It meets UL 94 V-0 flammability at 1/8 inch thickness.

Product Family
GR750X1  
Pellet
14 mm
4.4 gr
10 kg

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 8 - 12 weeks Shipping in 8 - 12 weeks

Technical Specifications

General Properties
Color
Color
The color
Black
Chemical Properties
Extractable Ionic Content, after 20 hours
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
15 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
15 ppm
Moisture Absorption
Moisture Absorption
Moisture absorption shows the capacity of a polymer to absorb moisture from its environment.

Absorbed moisture can reduce the glass transition temperature and strength of a polymer and can also result in popcorning, unreliable adhesion or voids in the bond line due to moisture desorption or entrapment.

Moisture absorption should always be mentioned with the test conditions to provide a meaningful frame of reference.
Moisture absorption - 168h @ 85ºC | 85% RH 0.3 %
Mechanical Properties
Flexural Modulus
Flexural Modulus @ 25°C 18042 N/mm2
Flexural Strength
Flexural Strength @ 25°C
Flexural Strength @ 25°C
Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C
136 N/mm2
Water Extract Data, 20hrs water boil
Water Extract Data, 20hrs water boil
Water Extract Data, 20hrs water boil
pH of extract 6
Storage (DMA) Modulus
Storage (DMA) Modulus @ 260°C 1713 N/mm2
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
1.7x1016 Ohms⋅cm
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
8 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
42 ppm/°C
Gel Time
Gel Time
Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable.

It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F 24 s
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
207 °C
Spiral Flow
Spiral Flow @ 175°C 92 cm
UL94 Rating
UL94 @ 1/8 inch V0
Curing Conditions
Curing Time
Curing Time @ 175°C / 347°F 90 s
Mold Temperature 180 °C

Additional Information

GR750 X1 Reliability test results

Package type: TO247

Leadframe: Cu/Ni

Test  Item

Parameters

Sample quantity

Test period

Criteria

Test Result

HTRB

TA=175°C @ 80% of
Max VR

77pcs

168/500/1000 hrs

JESD22-A108D

PASS

TC

 -55℃,15 mins; 150℃,15mins.

77pcs

200/500/1000 cycles

JESD22-A104D

PASS

AC

TA=121℃±2℃, RH=100%,P=15PSIG

77pcs

96 hrs

JESD22-A102D

PASS

HAST

130°C, 85%RH @80% of Max VR up to 42V

77pcs

96 hrs

JESD22-A110D

PASS

H3TRB

85°C, 85%RH @80% of Max VR up to 100V

77pcs

1000 hrs

JESD22-A101C

PASS

 

Post mold curing conditions and how they affect the final properties 

PMC condition Tg by TMA CTE 1 CTE 2 Storage modulus at RT Storage modulus at 175 Storage modulus at 260 Tg by loss modulus peak Tg by tand peak
175C*4h 177 11 39 21784 11671 1507 180 190
190C*10h 192 10 33 22596 17002 1608 199 210
175C*24h 192 11 36 23843 18427 1655 197 205

 

 

Comparison of the entire GR7XXX product series

 

Product Name

MG15F-MOD2

MG15F-0140

GR750 (Std)

GR750 X1 (Std)

GR750X1
(low CTE)

GR720X2 (Std)

GR750 X2FF
fine filler

GR720X2

 (high CTE)

Epoxy type

-

OCN/BisA/DCPD

OCN/BisA

MFN

MFN/L.W.A.

MFN/L.W.A.

MFN/L.W.A.

MAR

MAR/L.Vis.

Hardener type

-

Anhydride

Anhydride

New

New

New

New

New

New

Filler cut size

µm

106

150

75

75

75

75

45

75

Flammability

UL-94

V-0 at ¼”

V-0 at 1/8''

V-0 at 1/8''

V-0 at 1/8''

V-0 at 1/8''

V-0 at 1/8''

V-0 at 1/8''

V-0 at 1/8''

Spiral Flow

inches

36

20

42

36

26

45

40

41

Gel Time

sec

32

17

26

24

29

30

30

35

Viscosity @ 175°C

PaS

20

28

10

13

43

25

20

15

Tg by TMA

oC

242

195

225

202

197

170

182

170

CTE 1

ppm/°C

16

21

10

8

6

9

9

14

CTE 2

ppm/°C

49

70

40

42

31

35

32

40

DMA Storage Modulus at RT

MPa

18246

14078

20560

23155

29241

21631

23391

20971

DMA Storage Modulus at 260C

MPa

6491

1883

1658

1713

1711

907

1007

961

Tg by DMA Tanδ Peak

0C

270

217

235

207

200

177

182

177

Flexural modulus

Mpa

16312

12449

16880

18042

21469

17470

17549

16900

Flexural strength

Mpa

120

126

138

136

134

152

169

150

Moisture absorption PCT24h

%

0.55

0.65

0.35

0.3

0.2

0.2

0.2

0.2

Cl-/ Na+

ppm

<10

<10

<15

<15

<15

<15

<15

<15

PH

 

4~6

4~6

5~7

5~7

5~7

5~7

5~7

5~7

Volume resistivity @21C & 500V

Ω.cm

2.4E+16

6.3E+16

3.3E+16

1.7E+16

1.0E+16

1.6E+16

1.8E+16

1.0E+16

Dielectric constant, 21 C & 1MHz

 

3.6

3.7

3.7

3.7

3.7

3.8

3.8

3.9

Adhesion (tabpull) after MSL3

on Cu

N

344

136

365

406

307

360

407

331

on Ag

N

235

NA

345

363

269

234

348

415

on Ni

N

84

111

170

194

130

104

102

110

Comparative Tracking Index

V

600

400

600

600

600

600

600

600

Recommended Molding condition

190°C110s

180°C100s

180°C 90s

180°C 90s

180°C 90s

180°C 90s

180°C 90s

180°C 90s

Recommended PMC condition

190°C 3~6hrs

190°C 3~6hrs

190°C10hrs

190°C10hrs

190°C10hrs

190°C10hrs

190°C10hrs

190°C10hrs

 

 

DETA Data for the GR7XX product line