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LOCTITE SI 5404 is designed to bond metallic heat sinks, ceramic chips and circuit board substrates. LOCTITE SI 5404 applications include the bonding of various heat generating devices (power devices) to their respective heat sinks.
LOCTITE SI 5404 is designed to provide a strong bond between the device and its heat sink as well as low resistance to the flow of heat from the electronic device to the heat sink. A typical application would be the bonding of any power semiconductor, module, graphics processor or other heat generating device to a heat sink or metal enclosure in an electronics circuit.
IR or Convection oven