Hysol MG15F-0140 | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.90 |   Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
  • Anhydride cured
  • Tg: 195°C
  • For power discretes and high voltage rectifiers

Product Description

Hysol MG15F-0140 is a black, semiconductor grade, anhydride curing epoxy molding compound designed for high voltage power applications requiring good electrical stability at high temperature. A real classic. The work horse, as the industry would call it, product of the halogen and anhydride containing chemistries.

Hysol MG15F-0140 was typically used for power discretes and high voltage rectifiers. Despite its glorious history, the industry has been leaning towards next generation compounds that are future proof while still maintaining the same, or sometimes even better mold properties. GR 750 and the GR 750 XX series in general have nothing to envy and are good drop in candidates for the old guard.

 

MG15F-0140 will be discontinued by end of this year since its flame retardant (Dechlorane Plus) will be banned by the Chinese government by 2024. MG15F-0140 will be replaced with MG15F-0140B.
Product Family
MG15F-0140  
Powder
N/A mm
N/A gr
1 kg

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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Technical Specifications

General Properties
Color
Color
The color
Black
Filler Content 69 %
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
1.81
Shelf Life
Shelf Life @ 5°C 365 days
Chemical Properties
Moisture absorption 0.65 %
Ionic Content
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
5 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
3 ppm
Physical Properties
Spiral Flow @ 175°C 50.8 cm
Thermal Properties
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
195 °C
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
0.66 W/m.K
UL 94 Rating
UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole
V0
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
21 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
70 ppm/°C
Gel Time
Gel Time @ 175°C / 347°F 17 s
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
6.3x1016 Ohms⋅cm
Dielectric Constant
Dielectric Constant @ 1000 kHz 3.7
Mechanical Properties
Water Extract Data
pH of extract 4.4
Flexural Strength
Flexural Strength @ 25°C
Flexural Strength @ 25°C
Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C
127 N/mm2
Storage (DMA) Modulus
Storage (DMA) Modulus @ 25°C 14078 N/mm2
Storage (DMA) Modulus @ 260°C 1883 N/mm2
Curing Conditions
Transfer Time 6 - 15 s
Post Mold Cure
Post Mold Cure @ 175°C / 347°F 8 - 12 hrs
Curing Schedule
Curing Time @ 175°C / 347°F (Conventional Mold) 60 - 75 s
Mold Temperature 175 - 200 °C
Preheat Temperature 75 - 95 °C