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LOCTITE 3875 bead-on-bead, thermally conductive adhesive is designed to thermally couple and structurally bond heats sinks to heat dissipating electronic components. It is formulated to cure when the two components come into contact with one another, requiring no primer or heat.
LOCTITE 3875 is a two component acrylate, that is easy to use and can cure at room temperature. It is typically used for thermal management in transistors, rectifiers and computing applications such as memory chips, chipsets and gpu assemblies.
Thermal Exposure (1000 hours)