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LOCTITE® ABLESTIK 2332 is a solventless epoxy adhesive that develops high bond strength when cured at temperatures as low as 100°C. This product combines toughness at low temperatures plus high peel and tensile shear strengths over a very broad temperature range
LOCTITE® ABLESTIK 2332 is a black, heat curing non conductive adhesive, ideal for Copper, Aluminum, Nickel, FRP surfaces and Rigid plastics. It is a universal adhesive that can be used, among others, for SMD components, caps and lids.