PEAM-1044 Low warpage Polyester Acrylate/Methacrylate

Main features
  • Thermally stable
  • Low warpage
  • High adhesion to various substrates

Product Description

PEAM-1044 is a polyester acrylate/methacrylate that exhibits excellent adhesion, low warpage, and hydrophobicity. The oligomer has very high thermal stability and low volatility. It can be used as a base resin in a formulation or an additive. It is dark amber-colored, something that needs to be considered for light cure application.

PEAM-1044 is recommended for use as a base resin. It has excellent adhesion with low stress due to its high Tg DCPD units. The oligomer has good solubility in both aliphatic and aromatic resins. Exceptionally low warpage can be achieved with the addition of polybutadiene type resins. Compared to what most people use (epoxies) the PEAM-1044 is composed of large, low functionality, oligomers instead of small, highly cross-linked monomers. That's why it is common to use PEAM 645 which is more akin to epoxies or a combination of both.

Product Family
1kg Jar

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Technical Specifications

General Properties
Appearance at room temperature.
Amber Liquid
Physical Properties
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
4,500 mPa.s
Mechanical Properties
Tensile Modulus
Tensile Modulus
Tensile modulus is a mechanical property that measures the stiffness of an elastic material. It is the slope of stress / strain curve of a material under direct tensile loading.

It can be used to predict the elongation or elastic deformation of an object as long as the stress is less than the tensile strength of the material. Elastic deformation is caused by stretching the bonds between atoms and the deformation can be reversed when the load is removed.

Tensile modulus is affected by temperature and is an important engineering attribute since we generally want to keep elastic deformation as small as possible.
Tensile Modulus @-65°C 2,600 N/mm2
Tensile Modulus @150°C 15 N/mm2
Tensile Modulus @25°C 55 N/mm2
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
93 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
225 ppm/°C
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
-25 °C