PEAM-645 High Tg Polyester Acrylate/Methacrylate

Main features
  • High Tg
  • Low CTE
  • High adhesion to various substrates

Product Description

PEAM-645 is a polyester acrylate/methacrylate that exhibits low CTE, high Tg, and high modulus. The oligomer has very high thermal stability and low volatility. It can be used as a base resin in a formulation or as an additive. It exhibits good adhesion on various substrates. The oligomer also exhibits good hydrolytic stability

PEAM-645 is recommended for use as a base resin in adhesive applications or coating applications. The material if used alone can exhibit brittleness and the incorporation of a toughener (such as ABS, or hyperbranched polyester) is recommended. The oligomer has good solubility in both aliphatic and aromatic co-monomers. PEAM-645 is more akin to epoxies with the smaller molecular weight (still big compared to most epoxies but much smaller than the PEAM-1044) and with higher Tg as a result. It common to mix these product for optimal results.

Product Family
1kg Jar
Normal Price
Sale Price
Quantity OrderedPrice per Jar
  1 - 4 Jar  $666.607 /Jar
  5 - 9 Jar  $483.211 /Jar
  10 - 24 Jar  $377.018 /Jar
  25 - 99 Jar  $322.792 /Jar
  100 - 499 Jar  $269.948 /Jar
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Technical Specifications

General Properties
Appearance at room temperature.
Amber Liquid
Physical Properties
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
5,000 mPa.s
Mechanical Properties
Tensile Modulus
Tensile Modulus
Tensile modulus is a mechanical property that measures the stiffness of an elastic material. It is the slope of stress / strain curve of a material under direct tensile loading.

It can be used to predict the elongation or elastic deformation of an object as long as the stress is less than the tensile strength of the material. Elastic deformation is caused by stretching the bonds between atoms and the deformation can be reversed when the load is removed.

Tensile modulus is affected by temperature and is an important engineering attribute since we generally want to keep elastic deformation as small as possible.
Tensile Modulus @-65°C 4,100 N/mm2
Tensile Modulus @150°C 1,600 N/mm2
Tensile Modulus @25°C 3,400 N/mm2
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
50 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
173 ppm/°C
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
160 °C