PEAM-1769 Difunctional (meth)acrylate

Main features
  • Ultra low modulus
  • Thermal stability
  • High adhesion to various substrates

Product Description

PEAM-1769 is a polyester acrylate/methacrylate that exhibits excellent adhesion, low warpage, and hydrophobicity. The oligomer has very high thermal stability and low volatility. It can be used as a base oligomer in a formulation or an additive. It is dark amber-colored, something that needs to be considered for light cure application.

PEAM-1769 is recommended for use as a base resin or an additive to reduce stress. It has excellent adhesion on most substrates with low stress and low shrinkage due to its high Tg polycyclic repeat units. The oligomer has good solubility in both aliphatic and aromatic solvents and monomers.

Product Family
1kg Jar
Normal Price
Sale Price
Quantity OrderedPrice per Jar
  1 - 4 Jar  $594.457 /Jar
  5 - 9 Jar  $409.925 /Jar
  10 - 24 Jar  $303.075 /Jar
  25 - 99 Jar  $253.58 /Jar
  100 - 149 Jar  $240.916 /Jar
  150 - 499 Jar  $230.792 /Jar
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Technical Specifications

General Properties
Appearance at room temperature.
Amber liquid
Functionality 2
Molecular weight 1769 g/mol
Physical Properties
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
20000 mPa.s
Mechanical Properties
Tensile Modulus
Tensile Modulus
Tensile modulus is a mechanical property that measures the stiffness of an elastic material. It is the slope of stress / strain curve of a material under direct tensile loading.

It can be used to predict the elongation or elastic deformation of an object as long as the stress is less than the tensile strength of the material. Elastic deformation is caused by stretching the bonds between atoms and the deformation can be reversed when the load is removed.

Tensile modulus is affected by temperature and is an important engineering attribute since we generally want to keep elastic deformation as small as possible.
Tensile Modulus @-65°C 1300 N/mm2
Tensile Modulus @150°C 1 N/mm2
Tensile Modulus @25°C 48 N/mm2
Thermal Properties
Decomposition Temperature >375 °C
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
-40 °C
Other Properties
Storage Temperature 10 °C