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LOCTITE® ABLESTIK 8302 electrically conductive die attach adhesive is designed for high reliability package applications. It is a heat cured, silver filled die attach paste suited for PPF, Bare copper and Ag plated Cu leadframes.
LOCTITE® ABLESTIK 8302 contains no spacers (and there are no plans to create a spacer version) and is a multi purpose die attach paste, suitable for broad application spaces with relatively low modulus (2000 MPa @ RT, 180 MPa @ 250C). It is designed for QFP and SO devices with broad die size range (1x1 to 8x8mm) using Bare Cu, Ag spot and PPF leadframes.
Loctite Ablestik 8302 MSL Testing results