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LOCTITE ABLESTIK QMI550 non conductive die attach paste was designed to attach integrated circuits and components to advanced substrates. It is an off white, fluoropolymer filled, BMI hybrid that is stable at high temperatures.
LOCTITE ABLESTIK QMI550 has excellent interfacial adhesion strength and cohesive strength with great dielectric properties. It is designed for PBGA, CSP, array packages and die stack substrates and works great with Solder masks, BT, FR, Polyimide, Au and other organic surfaces.
Recommended Cure Schedule