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Hysol GR900C Q1L4E | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.40 |   Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
  • Low filler cut size
  • MSL1 260°C Capable EMC
  • Compatible with Copper Wire

Product Description

Hysol GR900C Q1L4E is a low filler cut version of Q1L4. Filler cut size is 53um instead of 75um so it flows much better. This product was initially destined to be an E version of GR900 Q1L4 but it ended up having it's own product code as GR900C. Q1L4E is added for completion and to avoid misunderstandings. Don't ask. It is a black semiconductor-grade epoxy molding compound designed for the encapsulation and protection of quad-flat no-leads (QFN) and dual-flat no-leads (DFN). 

Hysol GR900C Q1L4E is a spherical silica filled (86.5%) high end epoxy, typically used for QFN and DFN packages. It is mostly destined for larger package sizes between 5x5 and 7x7 QFN. This product is formulated to have a very low internal stress to reduce warpage, as well as low moisture absorption to increase MSL performance to MSL 1 @260°C with 3x reflow.

Hysol GR900C Q1L4E is an environmentally "green" halogen free product, meaning that it doesn't contain any bromine, antimony or phosphorus flame retardants. Previous MG-series EMC dominated the space for power semiconductors but used halogen-containing flame retardants. This next generation epoxy mold compound replaces these older generation products. To add to that, this material is designed to achieve JEDEC Level 1 requirements at 260°C reflow temperature on preplated or NiPdAu leadframes. It meets UL 94 V-0 Flammability at 1/8 inch (3.18mm) thickness.

Product Family
14.3 mm
6 gr
15 kg

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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Technical Specifications

General Properties
The color
Filler Content 86.5 %
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C 183 days
Chemical Properties
Ionic Content
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
8 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
3 ppm
Mechanical Properties
Flexural Modulus
Flexural Modulus @ 25°C 19000 N/mm2
Flexural Strength
Flexural Strength @ 25°C
Flexural Strength @ 25°C
Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C
150 N/mm2
Molded Shrinkage 0.3 %
Water Extract Data
Water Extract Data
Water Extract Data, 20hrs water boil
pH of extract 5.8
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
11 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
37 ppm/°C
Gel Time
Gel Time
Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable.

It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F 38 s
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
120 °C
Spiral Flow
Spiral Flow @ 175°C 132 cm
Curing Conditions
Curing Time
Curing Time @ 175°C / 347°F 90 - 150 s
Mold Temperature 170 - 185 °C
Preheat Temperature 70 - 90 °C
Transfer Pressure 40 - 85 kg/cm2
Transfer Time 7 - 15 s
Post Mold Cure
Post Mold Cure @ 175°C / 347°F 4 - 8 hrs

Additional Information


GR900C Q1L4E passes MSL 1 on QFN 5x5

This test has been conducted on CU with Ag plating and with ABL8600 silver paste.