Hysol GR900 Q1L4 | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.40 |   Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
  • MSL1 260°C
  • Designed for QFN and DFn packages
  • Compatible with Copper Wire

Product Description

Hysol GR900 Q1L4 is a black semiconductor-grade epoxy molding compounddesigned for the encapsulation and protection of quad-flat no-leads (QFN) and dual-flat no-leads (DFN). Once molded and post-mold cured, this product provides optimum protection and reliability for these semiconductor devices.

Hysol GR900 Q1L4 is a spherical silica filled (89%) EMC, typically used for QFN and DFN packages. QFN and DFN packages are low-profile packages that are MAP molded. This means that the packages are molded together in one large mold and then separated by cutting through the entire package. Epoxy molding compounds made for these type packages must have a low warpage, and GR900 Q1L4 is no exception. This product is formulated to have a very low internal stress to reduce warpage, as well as low moisture absorption to increase MSL performance.

Hysol GR900 Q1L4 is an environmentally "green" halogen free product, meaning that it doesn't contain any bromine, antimony or phosphorus flame retardants. Previous MG-series EMC dominated the space for power semiconductors but used halogen-containing flame retardants. This next generation epoxy mold compound replaces these older generation products. To add to that, this material is designed to achieve JEDEC Level 1 requirements at 260°C reflow temperature on preplated or NiPdAu leadframes. It meets UL 94 V-0 Flammability at 1/8 inch (3.18mm) thickness.

Product Family
GR900Q1L4  
Pellet
14 mm 55 mm
5.6 gr 4.4 gr 85 gr
10 kg 15 kg

Catalog Product

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Technical Specifications

General Properties
Color
Color
The color
Black
Filler Content 89 %
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
2.02
Shelf Life
Shelf Life @ 5°C 183 days
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
2.7x1016 Ohms⋅cm
Chemical Properties
Ionic Content
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
8 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
3 ppm
Physical Properties
Spiral Flow @ 175°C 124 cm
Thermal Properties
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
124 °C
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
0.9 W/m.K
UL 94 Rating
UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole
V0
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
7 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
24 ppm/°C
Gel Time
Gel Time @ 175°C / 347°F 36 s
Mechanical Properties
Molded Shrinkage 0.19 %
Water Extract Data
pH of extract 5.6
Flexural Modulus
Flexural Modulus @ 25°C 22646 N/mm2
Flexural Strength
Flexural Strength @ 25°C
Flexural Strength @ 25°C
Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C
158 N/mm2
Hardness
Hot Hardness, Shore D @ 175°C 82
Curing Conditions
Transfer Pressure 40 - 100 kg/cm2
Transfer Time 5 - 30 s
Post Mold Cure
Post Mold Cure @ 175°C / 347°F 4 - 8 hrs
Curing Schedule
Curing Time @ 175°C / 347°F 120 s
Mold Temperature 175 - 190 °C
Preheat Temperature 70 - 90 °C