Product Description
LOCTITE® ECCOBOND FP4654 is a low stress, Fill Encapsulant designed for larger cavity-fill or dam-and-fill applications. It is self levelling, jettable and provides an excellent thermal stability.
LOCTITE® ECCOBOND FP4654 has one of the lowest CTE α1 among the series (13ppm) and is our closest "mold compound" simulator with the highest (80%) Silica filler loading.
Recommended Cure Schedule
- 30 minutes @ 125°C plus
- 90 minutes @ 165°C