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LOCTITE® ECCOBOND FP4654 is a low stress, Fill Encapsulant designed for larger cavity-fill or dam-and-fill applications. It is self levelling, jettable and provides an excellent thermal stability.
LOCTITE® ECCOBOND FP4654 has one of the lowest CTE α1 among the series (13ppm) and is our closest "mold compound" simulator with the highest (80%) Silica filler loading.
Recommended Cure Schedule