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LOCTITE ECCOBOND 50300LT glob top is designed for encapsulating wire bonded bare die on epoxy laminate and similar substates. The formulation of this single component material ensures a long pot and a very stable viscosity during use.
LOCTITE ECCOBOND 50300LT is recommended for use large ICs with high wire profile. It is the less thixotropic version of LOCTITE ECCOBOND 50300HT and LOCTITE ECCOBOND 50300-1.
Low Stress Cure Schedule
For best results, substrate should be preheated (up to a maximum of 70ºC) to obtain the optimum flow under and around the wires.