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LOCTITE ECCOBOND 50300-1 glob top is designed for encapsulating wire bonded bare die on epoxy laminate and similar substates. The formulation of this single component material ensures a long pot and a very stable viscosity during use.
LOCTITE ECCOBOND 50300-1 is recommended for use on ICs with high wire profiles and in applications where the spreading of the glob top during cure must be controlled. It is a 70% filled product with 100% solids by weight.
Low Stress Cure Schedule
For best results, substrate should be preheated (up to a maximum of 70ºC) to obtain the optimum flow under and around the wires.