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LOCTITE® ECCOBOND EO7021 one component encapsulant is designed for use in smart card chip module applications. It cures fast at moderate temperatures and is also suitable for die attach automated reel to reel processing.
LOCTITE® ECCOBOND EO7021 has great compatibility with the newly formulated LOCTITE ABLESTIK ABP 2035SCR which and has been improved to be compatible with UV-curable smart card encapsulants.
Recommended Cure for Reel-to-Reel Processing
Alternate Cure for Reel-to-Reel Processing
This applies only to coating chip module with 10 to 100 mg of LOCTITE EO7021.
Recommended Cure for Non-Conductive Die Attach Application