LOCTITE ECCOBOND EO7021
- Fast cure
- Low viscosity
- Glob top
LOCTITE® ECCOBOND EO7021 one component encapsulant is designed for use in smart card chip module applications. It cures fast at moderate temperatures and is also suitable for die attach automated reel to reel processing.
LOCTITE® ECCOBOND EO7021 has great compatibility with the newly formulated LOCTITE ABLESTIK ABP 2035SCR which and has been improved to be compatible with UV-curable smart card encapsulants.
| Specific Gravity |
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.
For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
| Viscosity |
Viscosity is a measurement of a fluid’s resistance to flow.
Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.
A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
| Elongation |
Elongation is the process of lengthening something.
It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks.
It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
| Glass Transition Temperature (Tg) |
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.
The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
Recommended Cure for Reel-to-Reel Processing
- Substrate and Chip Module Preheat, ºC 100
- Precure 3 minutes @ 140°C
- Postcure (after reel is completely full) 16 hours @ 100°C
Alternate Cure for Reel-to-Reel Processing
- Precure 1 hour @ 100°C
- Postcure 6 hours @ 120°C
This applies only to coating chip module with 10 to 100 mg of LOCTITE EO7021.
Recommended Cure for Non-Conductive Die Attach Application
- 1 hour @ 120°C or
- 5 minutes @ 150°C