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LOCTITE ECCOBOND FIL 7010C is a low viscosity, one component, SVHC free, epoxy product designed for use as a potting or encapsulation resin protection for stress sensitive electronic components. It is specially formulated with a low thermal expansion and high Tg, along with a toughened polymer backbone making it ideally suited to survive severe thermal shock conditions with a high resistance to micro cracking.
LOCTITE ECCOBOND FIL 7010C is a REACH compliant product, designed to survive constant service temperatures of 150°C, with peak temperatures of up to 180°C for chip on board encapsulation.
Directions for use
For the low stress schedule we need to point out that according to the DSC curve the cure reaction barely starts at 100-125C. Yes, it happens and yes it is a low stress alternative but given the oven temperature tolerances, batch to batch variations etc we always run the risk of inconsistent results. You should always develop a process that works for your application but for repeatable and predictable results we recommend curing at least at 140°C.
Alternative schedules that could reduce warpage are: