Product Description
LOCTITE® ECCOBOND EO 7029 is a highly thixotropic, one component epoxy encapsulant with fast curing capability at moderate temperature and is designed specifically as non conductive die attach for smart card application and adjusted to be thixotropic to avoid flowing during cure.
Cure Schedule
- 5min @ 150°C. - Robust non-stress sensitive components
- 1hour @ 120°C. - Stress sensitive components