LOCTITE ECCOBOND FP4470

Harmonization Code : 3907.30.00.90 |   Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
  • High purity
  • Green product
  • Handles solder reflow temperatures

Product Description

LOCTITE ECCOBOND FP4470 is a silica/anhydride material (known in the US as CB0260) that features excellent flow properties allowing the material to penetrate fine pitch wires and deep cavities without entrapping voids. This proven epoxy encapsulant is used in high-reliability aerospace applications.

LOCTITE ECCOBOND FP4470 can withstand solder reflow after being exposed to JEDEC Level 2A (60°C/60% RH, 120 hours) preconditioning. It is a high adhesion version of FP4450 that handles higher solder reflow temperatures when necessary. In most cases it can be applied in the same way as 4450 with the same results and actually with lower moisture absorption.

Cure Schedule

  • 30 minutes @ 125°C + 90 minutes @ 165°C

LOCTITE ECCOBOND FP4470 should be dispensed onto a substrate warmed to approximately 75°C.

Product Family
FP4470  
10cc Syringe 30cc Syringe 6oz Cartridge

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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Technical Specifications

General Properties
Filler Content 75 %
Pot Life
Pot Life
Pot life is the amount of time it takes for the viscosity of a material to double (or quadruple for lower viscosity materials) in room temperature after a material is mixed.

It is closely related to work life but it is not application dependent, less precise and more of a general indication of how fast a system is going to cure.
72 hours
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
1.8
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ -40°C 274 days
Physical Properties
Viscosity
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
42,000 mPa.s
Chemical Properties
Ionic Content
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
2 ppm
Potassium (K+)
Potassium (K+)
The amount of Potassium (K+) ion extracted from the product in parts per million (ppm)
1 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
2 ppm
Water Absorption 0.5 %
Mechanical Properties
Flexural Modulus
Flexural Modulus @ 25°C 13000 N/mm2
Flexural Strength
Flexural Strength @ 25°C
Flexural Strength @ 25°C
Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C
137 N/mm2
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
18 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
65 ppm/°C
Gel Time
Gel Time
Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable.

It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 121°C / 250°F 12 minutes
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
148 °C
Other Properties
MSL Level MSL 2A

Additional Information

How does this product fare compared to the rest of the close FP family?

FP 4470 uses the same hardener system as 4450, but the epoxy/anhydride resin system is slightly more different compared to FP 4450(HF). Tg is lower and 4470 has few % higher filler loading for lower CTE (19 vs 17ppm). FP 4470 also has smaller filler particle size (<50um) vs FP 4450 and higher adhesion vs FP 4450(HF).

 

We have internal information showing that these legacy semiconductor liquids pass UL94HB at 1/8” thickness but do not have the test data or yellow card nor are we going to test for it. This is anecdotal but, hopefully, helpful.
The following are some older tested values for your assistance and information but, by no means, guaranteed specifications.

 

 

DSC Curve

The on-set temperature of FP4470 is around 140 Celsius as calculated by the X-section of the 2 red lines. You can imagine that the positioning of the red lines is a bit “subjective”, so different people & different software can get slightly different results from the same curve. Nevertheless, this is widely accepted as the “standard” method of calculating the on-set temperature.

A more interesting point is that the calculated on-set is always higher than the START of CURE. This is where the material starts to exotherm, and the baseline deviates upwards from a straight line. In this case it is 100 Celsius, so curing at 140C or 150C should be OK (similar to FP 4450 for which we recommend 165° Celsius cure, but companies have been using 140 Celsius for decades due to their "sensitive components".

 

Can I get the yield strength of FP4470?

Typically, we do not measure yield points on this style of product. The materials are relatively rigid and show very little elastic behaviour.

One way to demonstrate this is to run a die shear test. Some equipment (eg from Dage) will record & plot a stress/strain curve as the test is performed. We have not examined the plots from these specific materials, but we doubt they will show any significant elastic or plastic properties.

 

Material Property

FP4450

FP4470 (CB0260)

Color

Black

Grey/Black

Specific Gravity

1.77

1.8

Viscosity, cps (25°C 7/20)

53000

42000

DSC gel onset (°C), 10°C/min ramp rate

110/138

140/165

Gel Time (121°C, minutes)

12

12

Pot life (25°C, days)

3

>5

Shelf Life (-40°C), months

9

9

Cure Time, minutes

30/90

30/90

Cure Temperature, °C

125/165

125/165

Container Size

30cc

30cc

Filler Type

Silica

Silica

Hardener Type

Anhydride

Anhydride

Maximum Filler Size (microns)

120

50

Average Filler Size (microns)

35

8

CTE1 (ppm/°C)

19

17

CTE2 (ppm/°C)

72

64

Filler Weight (%)

73

75

Tg (°C) by TMA

159

148

Thermal Conductivity (W/mK)

0.63

0.7

Flexural Modulus @25°C, Gpa

10.2

12.7

Flexural Modulus @ 240°C, Gpa

 

0.6

Flexural Strength @25°C, Mpa

114

137

Flexural Strength @ 240°C, Mpa

 

17

Young's Modulus (Tensile Modulus), Gpa

13.5

 

Tensile Strength, Mpa

62.1

 

Poisson's Ratio

0.33

0.33

Elongation at break, %

1.81

 

Moisture Uptake, % (168hrs PCT)

0.8

0.5

Extractable Ionics (ppm; Na; Cl)

2; 7

1; 3

Linear Shinkage (%)

0.57

 

Shore D Harness @ RT

 

90

Thermal Stability (TGA), 10°C/min ramp rate

310/368

106 / 369

Oxygen Index

45.5

49.0

Alpha Count (alpha counts/ cm2 hr)

0.005

<0.001

Dielectric Constant @ 100KHz

3.62

3.5 1MHz

Dissipation Factor

0.004

0.001

Dielectric Breakdown (V/mil)

904.1

 

Volume Resistivity @100V, Ohm-cm

2.18E+16

5E+16

Surface Resistivity @100V, Ohms

2.57E+16

 

Flammability, 1/8" thickness

UL94HB

UL94HB

Specific Heat J/kg-K

1105

1078

Rheology @ 80°C, ps

120

10

Glob Height, mm

0.5

0.92

JEDEC Testability (internal)

none

L2A

RoHS Done?

Yes

Yes

No available data for Dielectric strength. According to our scientists a highly silica filled encapsulant will have a range of 20 to 40Kv/mm.