Mold release sprays are semiconductor mold maintenance products that are used in between transfer or compression molding shots to make sure that molded devices will “pop-off”” easily after cure. They […]
Liquid encapsulants and Epoxy molding compounds are generally two sides of the same coin. But what sets them apart? Find out in this blog.
Machine and Transverse directions are two crucial tape properties that define the orientation of their measured specifications.
Curing die attach pastes in a vacuum is not a great idea after all. Evaporation, lack of heat uniformity and contamination are to blame.
Die attach films enable very thin dies, eliminate fillets and achieve uniform bondline thickness. This aids miniaturising and 2.5D and 3D die stacking.
If you have been paying attention to the product developments over the last few years, reworkable underfills are gaining more and more traction over non reworkable ones. Without thinking about it […]
Package level EMI shielding reduces the dimensions and weight of the overall design and provides a compact and effective shielding method.
What are Phase change materials? Phase change materials (PCM) are silicone free pads and stencil printable pastes that are typically used as matrix materials for thermal interface applications. The magic […]