Curing die attach pastes in a vacuum is not a great idea after all. Evaporation, lack of heat uniformity and contamination are to blame.
Die attach films enable very thin dies, eliminate fillets and achieve uniform bondline thickness. This aids miniaturising and 2.5D and 3D die stacking.
Identifying resin bleed, separation and outgassing causes and troubleshooting the process, equipment and materials to reduce or eliminate it.
When it comes to high thermal conductivity die-attach options, an engineer is presented with four basic options: Electrically Conductive Die Attach Pastes Semi-Sintering Die Attach Pastes Silver Sintering Pastes Solder […]
The fingerprint sensor market has been steadily expanding. The emergence of fingerprint unlock for smartphones and laptops, the high adoption rates among governments and the emergence of biometric smart cards […]
CAPLINQ EUROPE BV SIGNS DEFINITIVE AGREEMENT TO REPRESENT HENKEL SEMICONDUCTOR PACKAGING MATERIALS IN EUROPE Amsterdam, The Netherlands (WEBWIRE) – October 10th, 2019 – CAPLINQ Europe BV announced today that it has become Henkel’s “European […]