Mold release sprays are semiconductor mold maintenance products that are used in between transfer or compression molding shots to make sure that molded devices will “pop-off”” easily after cure. They […]
Liquid encapsulants and Epoxy molding compounds are generally two sides of the same coin. But what sets them apart? Find out in this blog.
LET CAPLINQ HELP YOU SELECT AND APPLY THE PROPER CLEANING AND CONDITIONERS FOR EPOXY MOLD COMPOUNDS FROM OUR RANGE OF MELAMINE AND RUBBER CLEANING PRODUCTS When using Epoxy Mold Compound […]
CAPLINQ EUROPE BV SIGNS DEFINITIVE AGREEMENT TO REPRESENT HYSOL EPOXY MOLDING COMPOUNDS IN EUROPE AND THE AMERICAS Amsterdam, The Netherlands (WEBWIRE) – October 5th, 2020 – CAPLINQ Europe BV announced today that […]
Recently, a customer complained that he had a hard time correlating the wire bond sweep with material properties like spiral flow, filler content, filler size, etc. He was using mold flow analysis […]
By definition, the glass transition temperature (Tg) of an epoxy molding compound (EMC) is the temperature at which the EMC changes from a hard, glassy substance to a soft rubbery one. Physical […]
In the second half of August of 2018, Samsung SDI announced that it was exiting the epoxy molding compound for power discrete semiconductor packages. With almost a 4% market share of […]
In a previous article, we talked about how epoxy molding compound pellets have specific aspect ratios. In this article, we will explain in more detail how epoxy molding compounds pellets have […]