Heat Capacity of Epoxy Molding Compound

What is the heat capac­i­ty of epoxy mold com­pounds used in semi­con­duc­tor assembly?

Though this infor­ma­tion varies based on many vari­ables, the most crit­i­cal para­me­ters are the filler load­ing and the load­ing per­cent­age. Since most epoxy mold com­pounds use sil­i­ca as filler and are on aver­age between 80–85% loaded, the approx­i­mate heat capac­i­ty for these mate­ri­als is 0.8J/gK.

For more infor­ma­tion on epoxy mold com­pounds, or to request that CAPLINQ help you make the prop­er selec­tion, please con­tact us or vis­it the CAPLINQ web­site today for more information.

About Chris Perabo

Chris is an energetic and enthusiastic engineer and entrepreneur. He is always interested in taking highly technical subjects and distilling these to their essence so that even the layman can understand. He loves to get into the technical details of an issue and then understand how it can be useful for specific customers and applications. Chris is currently the Director of Business Development at CAPLINQ.

8 thoughts on “Heat Capacity of Epoxy Molding Compound

  1. Hi! I am doing a study about epoxy mold­ing com­pound. I would like to ask the process on how to mix the epoxy resin, cat­a­lyst, sil­i­ca filler, hard­en­er, and addi­tives. Prefer­ably the detailed pro­ce­dure. Thank you.

  2. what is the exact appli­ca­tion of epoxy mold compound,which type of indus­tries use it,and what are the grades avail­able in the market.can you give us some ref no in India.

  3. Epoxy Mold Com­pound is used to encap­su­late & pro­tect semi­con­duc­tor devices and elec­tron­ic mod­ules. His­tor­i­cal­ly, ceram­ic pack­ages with sol­dered and glass-fired seams were used, but because of the high price of such pack­ages, now these are typ­i­cal­ly only reserved for med­ical, mil­i­tary or aero­space appli­ca­tions — appli­ca­tions where the cost-to-change due to reg­u­la­to­ry or cus­tomer spec­i­fi­ca­tions is very, very high com­pared to the cost of the mate­ri­als themselves.

    More cost-sen­si­tive devices, such as con­sumer hand­helds, mobile phones, com­put­ers and any oth­er elec­tron­ic device now use epoxy to encap­su­late and pro­tect. Epoxy comes in sev­er­al forms, the most famil­iar being liq­uid, 2‑part form. These epox­ies were also used exten­sive­ly while the device mix was high and vol­umes were rel­a­tive­ly low. 

    Nowa­days, some man­u­fac­tur­ers and facil­i­ties make 20 — 40 bil­lion parts per year, and a liq­uid encap­su­la­tion sys­tem would be an enor­mous bot­tle neck. Epoxy Mold­ing Com­pounds are pre-mixed, b‑staged epox­ies that are put into mold­ing machines and trans­fer-mold­ed over semi­con­duc­tors and oher devices. Even auto­mo­tive man­u­fac­tur­ers are imple­ment­ing epoxy mold com­pounds to encap­su­late engine con­trol units (ECU) and oth­er auto­mo­tive components.

    Because the equip­ment required to mold devices is very expen­sive and has lim­it­ed flex­i­bil­i­ty com­pared to liq­uid-dis­pense sys­tems. The push to go from liq­uid epox­ies to mold com­pounds is only jus­ti­fied once the mix is low enough and the vol­ume is high enough to jus­ti­fy this invest­ment. All major semi­con­duc­tor com­pa­nies use this tech­nol­o­gy today.

  4. hi!i’m cur­rent­ly work­ing on my the­sis on semicon.i was just won­der­ing is it pos­si­ble make a epoxy mould­ing com­pound from digly­cidyl ether of bisphe­nol- A (DGEBA) with the addi­tion of MMT clay? what are the things need­ed for it to qual­i­fy and be called a mould­ing com­pound. i would be real­ly grate­ful for your reply. thank you!

  5. Kind­ly let me know how are major manu­fec­tur­ers of epoxy Mould­ing Com­pound in india? r u hav­ing any data about Epoxy com­pound Manu­fec­tur­ers to indi­an industry?

    i would be great­ful for your reply.

  6. CAPLINQ rep­re­sents SolE­poxy Epoxy Mold­ing Com­pounds, a major Epoxy Mold­ing Com­pound sup­pli­er of Coat­ing Pow­ders, and Indus­tri­al Mold­ing Com­pounds for Auto­mo­tive and Indus­tri­al Appli­ca­tions. Fur­ther­more, we have an exist­ing sup­ply chain already to India. Please send us a the detailed spec­i­fi­ca­tion you require and we can rec­om­mend a prod­uct for you and pro­vide a sample.

  7. hel­lo. I’m a uni­ver­si­ty stu­dent in Korea. I would like to ask you about epoxy mold­ing com­pound. I have to find a method to reduce CTE and increase ther­mal con­duc­tiv­i­ty but I can’t find mate­ri­als in google or oth­er web­sites. I think that some ingre­di­ents are con­tor­lled in EMC. Please help me I real­ly need some advice.

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