In the second half of August of 2018, Samsung SDI announced that it was exiting the epoxy molding compound for power discrete semiconductor packages. With almost a 4% market share of […]
Shin-Etsu SFX-513S, SFX-524A and SFX-526A are Wafer Backside Coating (WBC) Options for same-size die stacking.
Same size die stacking is different from other die stacking in that the bondline thickness must be a minimum of 60µm — 80µm high to ensure enough wirebond-loop height. In short, […]