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- Hysol GR600 SL2| Black Epoxy Mold Compound
Hysol GR600 SL2| Black Epoxy Mold Compound
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- High reliability
- High power applications
- Good electrical performance
Product Description
Hysol GR600 SL2 is a halogen free, black, silica filled (87% filler weight) semiconductor grade epoxy molding compound designed for TO packages. This low stress, low moisture absorption product is a commercial success with many uses on TO applications.
Hysol GR600 SL2 is a green, heat curable epoxy molding compound that can be used in semiconductor packages such as TO252. Furthermore, it meets UL 94 V-0 flammability at 1/8 inch thickness.
Technical Specifications
| General Properties | |||||||||
| Color Color The color | Black | ||||||||
| Filler Content | 87 % | ||||||||
| Specific Gravity Specific Gravity Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless. | 2.03 | ||||||||
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| Electrical Properties | |||||||||
| Volume Resistivity Volume Resistivity Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface. | 1.4x1016 Ohms⋅cm | ||||||||
| Chemical Properties | |||||||||
| Moisture absorption | 0.30 % | ||||||||
| Physical Properties | |||||||||
| Spiral Flow @ 175°C | 83 cm | ||||||||
| Thermal Properties | |||||||||
| Glass Transition Temperature (Tg) Glass Transition Temperature (Tg) The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs. | 165 °C | ||||||||
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| Mechanical Properties | |||||||||
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| Curing Conditions | |||||||||
| Transfer Pressure | 40 - 85 kg/cm2 | ||||||||
| Transfer Time | 5 - 15 s | ||||||||
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