Hysol GR640HV-L1 | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.90 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

Hysol GR640HV-L1 | Black Epoxy Mold Compound

Main features

Improved electrical performance version of GR640HV
Ideal for TO, SMX and SOT/SOD Packages
JEDEC 1 260°C capable product

Product Description

Hysol GR640HV-L1 is a black, heat-curable epoxy molding compound that delivers outstanding performance and ease of use. This material is designed to achieve JEDEC Level 1 requirements at 260°C reflow temperature. It is an improved version of GR640HV with better electrical performance version.

Hysol GR 640HV-L1 is a "Green" low stress product with low cost of ownership that meets the strict MSL1 JEDEC requirements. It is designed for semiconductor discrete packages such as TO220, TO247 and other TO packages, SMA, SMB and other SMX packages and Transformers. It is developed for eutectic bonding and not for die attach bonding. In eutectic bonding, an intermediate metal layer that forms a eutectic composition with either or both of the bonded components is used. Eutectic bonding is a low-temperature process, which is beneficial for temperature-sensitive applications where high temperatures affect the integrity of the device components. It is important to check the compatibility of Hysol GR640HV-L1 with the bonding process to maximize its excellent moisture sensitivity capability. GR640HV-L1 meets UL 94 V-0 Flammability at ¼ inch thickness.

Product Family
GR640HV-L1

1. Select Product Form

Pellet

2. Available Pellet Size

35 mm 14 mm

3. Available Pellet Weight

2.7 gr 4.3 gr 41 gr 68 gr

4. Available Package Size

15 kg

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Shortest leadtime

Shipping in 12 weeks

Contact for Pricing

Packaging

TDS, SDS & Technical documents

Specifications
Additional Information

Technical Specifications

General Properties

Color

Color
The color

Black

Filler Content

78 %

Specific Gravity

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

1.88

Shelf Life
Shelf Life @ 5°C	183 days

Thermal Properties

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

178 °C

UL 94 Rating

UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole

Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE), α1 Coefficient of Thermal Expansion (CTE), α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	14 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	44 ppm/°C

Gel Time
Gel Time @ 175°C / 347°F	39 s

Electrical Properties

Volume Resistivity

Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.

1.2x10¹⁶ Ohms⋅cm

Mechanical Properties

Flexural Modulus
Flexural Modulus @ 25°C	16500 N/mm2

Flexural Strength
Flexural Strength @ 25°C Flexural Strength @ 25°C Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C	150 N/mm2

Hardness
Hot Hardness, Shore D @ 175°C	81

Chemical Properties

Moisture absorption

0.4 %

Ionic Content
Chloride (Cl-) Chloride (Cl-) The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)	6 ppm
Sodium (Na+) Sodium (Na+) The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)	4 ppm