Hysol GR910-C | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide

Hysol GR910-C | Black Epoxy Mold Compound

Main features

Halogen free
High fluidity
Designed for BGA/LGA

Product Description

Hysol GR910 C is a black, epoxy, semiconductor grade molding compound designed for Memory ball grid arrays (BGA) and land grid arrays (LGA). This spherical silica filled product (cut size of 75um), offers high fluidity and low shrinkage that aids a very advanced warpage control.

Hysol GR910 C is a halogen free, environmentally friendly compound with good electrical performance that meets UL 94 V-0 Flammability at 1/8 inch thickness. You might also be interested in GR910-C4 an identical product with even lower smile shrinkage.

Specifications

Technical Specifications

General Properties

Color

Color
The color

Black

Filler Content

88 %

Specific Gravity

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

2.01

Shelf Life
Shelf Life @ 5°C	183 days

Chemical Properties

Moisture absorption

0.3 %

Ionic Content
Chloride (Cl-) Chloride (Cl-) The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)	7 ppm
Sodium (Na+) Sodium (Na+) The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)	4 ppm

Physical Properties

Spiral Flow @ 175°C

203 cm

Thermal Properties

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

130 °C

Thermal Conductivity

Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.

0.9 W/m.K

Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE), α1 Coefficient of Thermal Expansion (CTE), α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	9 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	23 ppm/°C

Gel Time
Gel Time @ 175°C / 347°F	47 s

Mechanical Properties

Flexural Modulus
Flexural Modulus @ 25°C	22000 N/mm2

Flexural Strength
Flexural Strength @ 25°C Flexural Strength @ 25°C Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C	160 N/mm2